XC3S1400A-4FG676I
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- Mfr.Part #
- XC3S1400A-4FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 502 I/O 676FCBGA
- Stock
- 39,711
- In Stock ：
- 39,711
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Number of Outputs :
- 408
- Base Part Number :
- XC3S1400A
- Qualification Status :
- Not Qualified
- Width :
- 27mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Length :
- 27mm
- Terminal Form :
- Ball
- Supply Voltage :
- 1.2V
- Power Supplies :
- 1.22.5/3.3V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Logic Elements/Cells :
- 25344
- RAM Size :
- 72kB
- Number of Gates :
- 1400000
- Number of I/O :
- 502
- Series :
- Spartan®-3A
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e0
- Package / Case :
- 676-BBGA, FCBGA
- ECCN Code :
- 3A991.D
- Operating Temperature :
- -40°C~100°C TJ
- Published :
- 2007
- Pin Count :
- 676
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Clock Frequency :
- 667MHz
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 589824
- Number of LABs/CLBs :
- 2816
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 676
- Peak Reflow Temperature (Cel) :
- 225
- RoHS Status :
- Non-RoHS Compliant
- Speed Grade :
- 4
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- Number of Terminations :
- 676
- Voltage - Supply :
- 1.14V~1.26V
- Operating Supply Voltage :
- 1.2V
- Datasheets
- XC3S1400A-4FG676I
FPGAs AMD Xilinx XC3S1400A-4FG676I Overview
The FPGAs AMD Xilinx XC3S1400A-4FG676I is a high-performance, field-programmable gate array designed to meet the demands of complex digital circuits. With its extensive I/O capabilities, housed in a compact 676-pin flip-chip ball grid array (FCBGA) package, this FPGA offers a versatile solution for a wide range of technological applications. AMD Xilinx's reputation for reliability and innovation is embodied in the XC3S1400A-4FG676I, making it an ideal choice for developers looking to push the boundaries of hardware acceleration, signal processing, and system integration.
XC3S1400A-4FG676I Features
The XC3S1400A-4FG676I FPGA from AMD Xilinx boasts a robust set of features suitable for high-demand applications. Key attributes include its 502 user I/Os, allowing for versatile connectivity options. The chip is engineered using advanced technology that supports a variety of logic implementations and configurability, ensuring adaptability to specific project requirements. Its thermal and power efficiency metrics are optimized for sustained performance, essential for continuous operation in critical systems.
XC3S1400A-4FG676I Applications
- Telecommunications Infrastructure: Used in the design and deployment of telecommunications hardware such as routers and switches, where high-speed signal processing is crucial.
- Automotive Electronics: Can be integrated into automotive safety and control systems, providing the computational power needed for advanced driver-assistance systems (ADAS).
- Industrial Automation: Ideal for use in automated manufacturing processes, where precise control and flexibility are required to manage complex operations.
- Consumer Electronics: Forms the backbone of many consumer electronics, including smart home devices and entertainment systems, where efficient processing and connectivity are key.
- Aerospace and Defense: Critical in the development of aerospace systems, such as navigation and control instruments, where reliability and high-level computation capabilities are mandatory.
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