XC3S1400A-4FG676C

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Mfr.Part #
XC3S1400A-4FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 502 I/O 676FCBGA
Stock
18,883
In Stock :
18,883

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Gates :
1400000
Time@Peak Reflow Temperature-Max (s) :
30
Clock Frequency :
667MHz
Operating Temperature :
0°C~85°C TJ
Series :
Spartan®-3A
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Outputs :
408
Power Supplies :
1.22.5/3.3V
Speed Grade :
4
Width :
27mm
Total RAM Bits :
589824
Package / Case :
676-BBGA, FCBGA
Number of I/O :
502
Number of Logic Elements/Cells :
25344
Number of Pins :
676
Number of Terminations :
676
RoHS Status :
Non-RoHS Compliant
Published :
2005
Length :
27mm
Peak Reflow Temperature (Cel) :
225
RAM Size :
72kB
Terminal Position :
BOTTOM
Operating Supply Voltage :
1.2V
JESD-609 Code :
e0
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
1.14V~1.26V
Reach Compliance Code :
not_compliant
Terminal Form :
Ball
Number of LABs/CLBs :
2816
Pin Count :
676
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.71 ns
Terminal Pitch :
1mm
Supply Voltage :
1.2V
ECCN Code :
3A991.D
Mount :
Surface Mount
Packaging :
Tray
Base Part Number :
XC3S1400A
Pbfree Code :
No
Factory Lead Time :
10 Weeks
Datasheets
XC3S1400A-4FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-4FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:676-BBGA, FCBGA, Number of Pins:676, Number of Terminations:676, Mounting Type:Surface Mount, Base Part Number:XC3S1400A, XC3S1400A-4FG676C pinout, XC3S1400A-4FG676C datasheet PDF, XC3S1400A-4FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-4FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1400A-4FG676C


FPGAs AMD Xilinx XC3S1400A-4FG676C Overview

Introducing the AMD Xilinx XC3S1400A-4FG676C, a high-performance FPGA (Field Programmable Gate Array) designed to meet the complex and varied needs of modern digital applications. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA delivers exceptional performance, flexibility, and integration capabilities for designers and developers. With its advanced system features and significant I/O capacity, the XC3S1400A-4FG676C is ideally suited for applications that require high-speed data processing and real-time execution. It provides a robust platform for developing advanced digital devices, contributing to enhanced system efficiency and reliability.

XC3S1400A-4FG676C Features

The XC3S1400A-4FG676C FPGA features a 676-pin flip-chip ball grid array (FCBGA) packaging that supports up to 502 I/O points, making it highly suitable for interfacing with a wide range of peripheral devices. This flexibility ensures that it can be integrated into complex systems with numerous inputs and outputs, without sacrificing performance or scalability. The FPGA's architecture is designed for optimal power efficiency and high-speed signal processing, making it an excellent choice for demanding applications that require quick data throughput and minimal latency.

XC3S1400A-4FG676C Applications

  • Telecommunications: Utilized in communication infrastructure to handle signal processing and data flow management, enhancing network efficiency and bandwidth management.
  • Automotive Systems: Integrated into driver assistance systems and infotainment systems to process real-time data from sensors and cameras, improving vehicle safety and passenger experience.
  • Industrial Automation: Used in control systems for real-time monitoring and management of industrial processes, increasing precision and productivity in manufacturing environments.
  • Consumer Electronics: Embedded in devices like high-definition televisions and gaming consoles to manage video processing and output, ensuring smooth, high-quality visual experiences.
  • Medical Devices: Applied in medical imaging systems to facilitate complex image processing tasks, enhancing diagnostic capabilities and patient outcomes.
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