XC3S1400A-4FG676C
- Mfr.Part #
- XC3S1400A-4FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 502 I/O 676FCBGA
- Stock
- 18,883
- In Stock :
- 18,883
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Gates :
- 1400000
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Clock Frequency :
- 667MHz
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Spartan®-3A
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Outputs :
- 408
- Power Supplies :
- 1.22.5/3.3V
- Speed Grade :
- 4
- Width :
- 27mm
- Total RAM Bits :
- 589824
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 502
- Number of Logic Elements/Cells :
- 25344
- Number of Pins :
- 676
- Number of Terminations :
- 676
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2005
- Length :
- 27mm
- Peak Reflow Temperature (Cel) :
- 225
- RAM Size :
- 72kB
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.2V
- JESD-609 Code :
- e0
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 1.14V~1.26V
- Reach Compliance Code :
- not_compliant
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 2816
- Pin Count :
- 676
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.2V
- ECCN Code :
- 3A991.D
- Mount :
- Surface Mount
- Packaging :
- Tray
- Base Part Number :
- XC3S1400A
- Pbfree Code :
- No
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC3S1400A-4FG676C

FPGAs AMD Xilinx XC3S1400A-4FG676C Overview
Introducing the AMD Xilinx XC3S1400A-4FG676C, a high-performance FPGA (Field Programmable Gate Array) designed to meet the complex and varied needs of modern digital applications. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA delivers exceptional performance, flexibility, and integration capabilities for designers and developers. With its advanced system features and significant I/O capacity, the XC3S1400A-4FG676C is ideally suited for applications that require high-speed data processing and real-time execution. It provides a robust platform for developing advanced digital devices, contributing to enhanced system efficiency and reliability.
XC3S1400A-4FG676C Features
The XC3S1400A-4FG676C FPGA features a 676-pin flip-chip ball grid array (FCBGA) packaging that supports up to 502 I/O points, making it highly suitable for interfacing with a wide range of peripheral devices. This flexibility ensures that it can be integrated into complex systems with numerous inputs and outputs, without sacrificing performance or scalability. The FPGA's architecture is designed for optimal power efficiency and high-speed signal processing, making it an excellent choice for demanding applications that require quick data throughput and minimal latency.
XC3S1400A-4FG676C Applications
- Telecommunications: Utilized in communication infrastructure to handle signal processing and data flow management, enhancing network efficiency and bandwidth management.
- Automotive Systems: Integrated into driver assistance systems and infotainment systems to process real-time data from sensors and cameras, improving vehicle safety and passenger experience.
- Industrial Automation: Used in control systems for real-time monitoring and management of industrial processes, increasing precision and productivity in manufacturing environments.
- Consumer Electronics: Embedded in devices like high-definition televisions and gaming consoles to manage video processing and output, ensuring smooth, high-quality visual experiences.
- Medical Devices: Applied in medical imaging systems to facilitate complex image processing tasks, enhancing diagnostic capabilities and patient outcomes.
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