XC3S1200E-4FT256I
- Mfr.Part #
- XC3S1200E-4FT256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FTBGA
- Stock
- 1,288
- In Stock :
- 1,288
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Total RAM Bits :
- 516096
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of LABs/CLBs :
- 2168
- Number of Logic Elements/Cells :
- 19512
- RoHS Status :
- Non-RoHS Compliant
- Power Supplies :
- 1.21.2/3.32.5V
- Pbfree Code :
- No
- Length :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Width :
- 17mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Registers :
- 17344
- Number of Gates :
- 1200000
- RAM Size :
- 63kB
- Speed Grade :
- 4
- Clock Frequency :
- 572MHz
- Series :
- Spartan®-3E
- Base Part Number :
- XC3S1200E
- Supply Voltage :
- 1.2V
- Peak Reflow Temperature (Cel) :
- 240
- Number of I/O :
- 190
- Number of Outputs :
- 150
- Published :
- 2009
- Number of Pins :
- 256
- Height Seated (Max) :
- 1.55mm
- Number of Terminations :
- 256
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e0
- Operating Temperature :
- -40°C~100°C TJ
- Operating Supply Voltage :
- 1.2V
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Pitch :
- 1mm
- Package / Case :
- 256-LBGA
- Datasheets
- XC3S1200E-4FT256I

FPGAs AMD Xilinx XC3S1200E-4FT256I Overview
Introducing the AMD Xilinx XC3S1200E-4FT256I, a robust Field Programmable Gate Array (FPGA) designed to deliver exceptional performance and flexibility. This device is tailored for engineers and designers who require a high-grade programmable logic solution that supports a wide range of applications. With a compact form factor in a 256FTBGA package, it offers a perfect balance between I/O capabilities and size, making it an ideal choice for space-constrained applications. The XC3S1200E-4FT256I is built to handle complex digital processing tasks with ease, ensuring efficient operation and reliability for critical projects.
XC3S1200E-4FT256I Features
The XC3S1200E-4FT256I FPGA is equipped with 190 I/O pins, allowing for extensive peripheral and module connections. This device operates effectively within a temperature range of -40°C to 100°C, making it suitable for use in harsh environments. Its 256FTBGA package ensures a minimal footprint on system boards, thus optimizing board space. Moreover, the FPGA offers robust security and protection features, ensuring safe and secure data handling and processing.
XC3S1200E-4FT256I Applications
- Telecommunications: Utilized in communication equipment for signal processing and data transport enhancements.
- Automotive Systems: Deployed in automotive electronics for control systems and driver assistance features.
- Industrial Automation: Enhances productivity and efficiency in robotics and process control systems.
- Consumer Electronics: Integral to devices requiring complex user interfaces and multimedia processing.
- Aerospace and Defense: Critical for navigation, control systems, and other sensitive applications requiring high reliability and extended temperature support.
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