XC2VP70-5FF1517C
- Mfr.Part #
- XC2VP70-5FF1517C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 964 I/O 1517FCBGA
- Stock
- 190
- In Stock :
- 190
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 964
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.5V
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 8272
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Factory Lead Time :
- 6 Weeks
- ECCN Code :
- 3A001.A.7.A
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e0
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- 225
- RAM Size :
- 738kB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Virtex®-II Pro
- RoHS Status :
- Non-RoHS Compliant
- Number of Logic Elements/Cells :
- 74448
- Voltage - Supply :
- 1.425V~1.575V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Bulk
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 1517-BBGA, FCBGA
- Supply Voltage :
- 1.5V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Height Seated (Max) :
- 3.4mm
- Number of Inputs :
- 964
- Length :
- 40mm
- Terminal Pitch :
- 1mm
- Speed Grade :
- 5
- Total RAM Bits :
- 6045696
- Operating Temperature :
- 0°C~85°C TJ
- Combinatorial Delay of a CLB-Max :
- 0.36 ns
- Number of I/O :
- 964
- Pbfree Code :
- No
- Published :
- 2011
- Width :
- 40mm
- Number of Registers :
- 66176
- Datasheets
- XC2VP70-5FF1517C

FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP70-5FF1517C Overview
The FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP70-5FF1517C is a high-performance integrated circuit engineered by the renowned AMD Xilinx. Designed to meet the demanding requirements of modern digital applications, this IC FPGA model boasts an extensive array of 964 I/O pins packaged in a compact 1517FCBGA format. This product facilitates robust and versatile configurations, suitable for a diverse range of applications requiring high-speed data processing and significant logic density. It represents an optimal solution for developers looking to push the boundaries of technological innovation while ensuring system scalability and reliability.
XC2VP70-5FF1517C Features
This FPGA unit stands out due to its advanced capabilities in handling complex digital computations at high speeds. Key features include the integration of 964 I/O pins, which provides ample flexibility in system design. The 1517FCBGA package ensures that despite the high number of inputs and outputs, the physical footprint remains manageable and efficient for board designers. The device's architecture is tailored to support scalable digital solutions, enabling extensive customizability and integration into existing technology stacks without compromising performance.
XC2VP70-5FF1517C Applications
- Telecommunications Equipment: Utilizes its high I/O count for managing multiple data streams simultaneously, enhancing data throughput and reliability in network hardware.
- Automotive Systems: Can be employed to coordinate complex sensor arrays and actuator systems in advanced driver-assistance systems (ADAS), contributing to enhanced vehicle safety and performance.
- Consumer Electronics: Ideal for high-definition video processing and complex user-interface designs in devices such as smartphones and tablets.
- Industrial Automation: Helps in the control and management of machinery in manufacturing lines, improving precision and productivity through advanced computational capabilities.
- Aerospace and Defense: Supports critical navigation and control systems with its robust processing power and high reliability in extreme environments.
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