XC2VP50-7FFG1152C
- Mfr.Part #
- XC2VP50-7FFG1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 692 I/O 1152FCBGA
- Stock
- 8,690
- In Stock :
- 8,690
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 3.4mm
- Width :
- 35mm
- Number of Logic Elements/Cells :
- 53136
- Package / Case :
- 1152-BBGA, FCBGA
- Series :
- Virtex®-II Pro
- RAM Size :
- 522kB
- JESD-609 Code :
- e1
- Total RAM Bits :
- 4276224
- Number of Outputs :
- 692
- Number of LABs/CLBs :
- 5904
- Number of Pins :
- 1152
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Published :
- 2011
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- Number of Registers :
- 47232
- Qualification Status :
- Not Qualified
- Number of I/O :
- 692
- Factory Lead Time :
- 6 Weeks
- Supply Voltage :
- 1.5V
- Length :
- 35mm
- Voltage - Supply :
- 1.425V~1.575V
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 245
- Operating Supply Voltage :
- 1.5V
- Speed Grade :
- 7
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.28 ns
- Clock Frequency :
- 1350MHz
- Reach Compliance Code :
- not_compliant
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- 3A991.D
- Pbfree Code :
- yes
- Packaging :
- Tray
- Base Part Number :
- XC2VP50
- Datasheets
- XC2VP50-7FFG1152C
FPGAs AMD Xilinx XC2VP50-7FFG1152C Overview
The FPGAs AMD Xilinx XC2VP50-7FFG1152C is a highly capable integrated circuit designed for demanding applications requiring high-speed, high-density logic operations. Manufactured by AMD Xilinx, this FPGA features a flexible architecture that supports a wide range of configurations and is packaged in a 1152-pin flip-chip ball grid array (FCBGA). This product is optimized for performance and scalability, making it an ideal solution for designers looking to leverage superior programmability in their digital circuit designs.
XC2VP50-7FFG1152C Features
This FPGA model is designed to meet the rigorous demands of modern digital circuits with its 692 user I/Os which facilitate extensive connectivity options. Its large logic capacity allows for the implementation of complex digital systems on a single chip, greatly reducing system latency and enhancing overall system reliability. The 1152FCBGA packaging ensures robust physical integration while providing excellent thermal management and reduced footprint on the circuit board.
XC2VP50-7FFG1152C Applications
- Data Centers: Utilized for managing data flow and processing tasks, enhancing efficiency and reducing operational costs through accelerated data handling capabilities.
- Telecommunications: Supports the infrastructure for high-speed communication networks by facilitating improved signal processing and bandwidth management.
- Automotive Systems: Critical in advanced driver-assistance systems (ADAS), providing the necessary computational power to process real-time inputs from multiple sensors.
- Medical Imaging: Applied in complex medical imaging systems such as MRI and ultrasound equipment for faster data processing and enhanced image resolution.
- Industrial Automation: Drives automation in manufacturing processes through customizable logic solutions that improve control systems and operational efficiency.
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