XC2VP50-5FF1517C
- Mfr.Part #
- XC2VP50-5FF1517C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 852 I/O 1517FCBGA
- Stock
- 42,559
- In Stock :
- 42,559
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Number of I/O :
- 852
- Combinatorial Delay of a CLB-Max :
- 0.36 ns
- Number of Outputs :
- 852
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of LABs/CLBs :
- 5904
- Series :
- Virtex®-II Pro
- Total RAM Bits :
- 4276224
- JESD-609 Code :
- e0
- Factory Lead Time :
- 6 Weeks
- Contact Plating :
- Lead, Tin
- Terminal Pitch :
- 1mm
- Reach Compliance Code :
- not_compliant
- Package / Case :
- 1517-BBGA, FCBGA
- Operating Supply Voltage :
- 1.5V
- Mount :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- Voltage - Supply :
- 1.425V~1.575V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Registers :
- 47232
- RAM Size :
- 522kB
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Length :
- 40mm
- Pbfree Code :
- No
- Supply Voltage :
- 1.5V
- Speed Grade :
- 5
- Number of Logic Elements/Cells :
- 53136
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Bulk
- Number of Inputs :
- 852
- Terminal Form :
- Ball
- Height Seated (Max) :
- 3.4mm
- Width :
- 40mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Published :
- 2011
- ECCN Code :
- 3A001.A.7.A
- Datasheets
- XC2VP50-5FF1517C

FPGAs AMD Xilinx XC2VP50-5FF1517C Overview
The FPGAs AMD Xilinx XC2VP50-5FF1517C is a highly versatile and powerful field programmable gate array designed for advanced digital processing tasks. Manufactured by AMD Xilinx, this IC FPGA is tailored for applications requiring high throughput, flexible I/O configurations, and extensive on-chip resources. Encapsulated in a 1517-pin flip-chip ball grid array (FCBGA) package, it offers an impressive array of 852 I/Os, making it ideal for complex, multi-functional systems. The integration of such expansive I/O capabilities with robust logic resources facilitates the development of high-performance, scalable hardware solutions in a wide range of industrial applications.
XC2VP50-5FF1517C Features
This FPGA from AMD Xilinx stands out with its extensive set of features designed to address the needs of high-speed and multifaceted digital environments. Key features include advanced configuration options, high-speed DSP slices, and extensive logic cells that allow for flexible and powerful system designs. The 1517FCBGA packaging not only ensures a compact form factor but also enhances the thermal management capabilities of the device, crucial for maintaining reliability and performance in demanding scenarios.
XC2VP50-5FF1517C Applications
- Telecommunications Infrastructure: Utilized in the development of routers, switches, and base stations, this FPGA supports high-speed data processing and complex algorithm implementations crucial for modern telecom networks.
- Data Center Solutions: Acts as the backbone for server acceleration technology, where it enhances data processing capabilities and supports the rapid growth of cloud computing demands.
- Industrial Automation: Integrates into control systems requiring high I/O throughput and adaptable logic configurations, optimizing process control and efficiency.
- Medical Imaging Systems: Plays a crucial role in high-resolution medical imaging devices, facilitating faster data analysis and real-time processing capabilities necessary for advanced diagnostics.
- Aerospace and Defense: Suitable for applications in navigation systems, satellite communications, and avionic computers where robustness and reliability are paramount.
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