XC2VP4-5FF672C

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Mfr.Part #
XC2VP4-5FF672C
Manufacturer
AMD Xilinx
Package / Case
672-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 348 I/O 672FCBGA
Stock
24,095
In Stock :
24,095

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Pin Count :
672
Number of CLBs :
752
Terminal Position :
BOTTOM
Factory Lead Time :
6 Weeks
Qualification Status :
Not Qualified
Number of Outputs :
348
Packaging :
Bulk
Speed Grade :
5
Pbfree Code :
No
Published :
2007
JESD-30 Code :
S-PBGA-B672
Time@Peak Reflow Temperature-Max (s) :
30
Combinatorial Delay of a CLB-Max :
0.36 ns
RAM Size :
63kB
Number of LABs/CLBs :
752
Voltage - Supply :
1.425V~1.575V
Width :
27mm
Terminal Form :
Ball
Operating Supply Voltage :
1.5V
ECCN Code :
3A991.D
RoHS Status :
Non-RoHS Compliant
Number of Inputs :
348
Peak Reflow Temperature (Cel) :
225
Total RAM Bits :
516096
Terminal Pitch :
1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
JESD-609 Code :
e0
Package / Case :
672-BBGA, FCBGA
Series :
Virtex®-II Pro
Number of Registers :
6016
Surface Mount :
yes
Number of I/O :
348
Length :
27mm
Number of Logic Elements/Cells :
6768
Mounting Type :
Surface Mount
Number of Terminations :
672
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Terminal Finish :
Tin/Lead (Sn63Pb37)
Supply Voltage :
1.5V
Datasheets
XC2VP4-5FF672C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP4-5FF672C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:672-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:672, XC2VP4-5FF672C pinout, XC2VP4-5FF672C datasheet PDF, XC2VP4-5FF672C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP4-5FF672C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP4-5FF672C


FPGAs AMD Xilinx XC2VP4-5FF672C Overview

The AMD Xilinx XC2VP4-5FF672C FPGA (Field Programmable Gate Array) represents a sophisticated synthesis of versatility, high performance, and integration suited for a broad range of applications. This IC features a robust 672FCBGA package, which houses an impressive array of 348 I/O ports, providing extensive interfacing capabilities. The flexible nature of the XC2VP4-5FF672C makes it an ideal choice for designers looking to implement complex digital logic while maintaining a compact footprint and minimizing power consumption. This FPGA is engineered to cater to demanding computational tasks and data-intensive applications, ensuring reliable operation and scalability in commercial and industrial settings.

XC2VP4-5FF672C Features

This FPGA is known for its high configurability and integration features which include:

  • 348 user I/Os allowing for extensive peripheral and modular interfacing.
  • 672-pin Fine-Pitch Ball Grid Array (FCBGA) package ensuring a reliable connection and small physical footprint.
  • Advanced process technology offering optimized performance and power efficiency.
  • Compatibility with multi-voltage systems, enhancing its utility across various digital ecosystems.

XC2VP4-5FF672C Applications

  • Telecommunications Equipment: Utilized in the development of routers, switches, and signal processing equipment, enhancing data flow and connectivity.
  • Automotive Electronics: Drives innovation in automotive safety and entertainment systems, supporting advanced driver-assistance systems (ADAS) and infotainment.
  • Industrial Automation: Key in automating complex industrial processes through control systems and robotics, increasing efficiency and precision.
  • Consumer Electronics: Empowers the next generation of home entertainment systems, including smart TVs and gaming consoles, by providing high-speed processing and rich multimedia experiences.
  • Medical Devices: Critical in the design of diagnostic and imaging equipment, contributing to faster and more accurate medical analyses.
This HTML content is crafted to emphasize the FPGA's broad utility and technical prowess, strategically positioning it to attract B2B customers interested in technology integration across various domains.
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