XC2VP30-5FF1152C
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- Mfr.Part #
- XC2VP30-5FF1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 644 I/O 1152FCBGA
- Stock
- 38
- In Stock ：
- 38
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 6 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 644
- Surface Mount :
- yes
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 3.4mm
- Combinatorial Delay of a CLB-Max :
- 0.36 ns
- Operating Supply Voltage :
- 1.5V
- Voltage - Supply :
- 1.425V~1.575V
- Supply Voltage :
- 1.5V
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Bulk
- Package / Case :
- 1152-BBGA, FCBGA
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of LABs/CLBs :
- 3424
- Number of Outputs :
- 644
- Published :
- 2011
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Registers :
- 27392
- Pbfree Code :
- No
- Total RAM Bits :
- 2506752
- RAM Size :
- 306kB
- Speed Grade :
- 5
- Series :
- Virtex®-II Pro
- Qualification Status :
- Not Qualified
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 225
- JESD-609 Code :
- e0
- Number of Inputs :
- 644
- Number of Logic Elements/Cells :
- 30816
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Datasheets
- XC2VP30-5FF1152C
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FPGAs AMD Xilinx XC2VP30-5FF1152C Overview
Introducing the FPGAs AMD Xilinx XC2VP30-5FF1152C, a cutting-edge IC FPGA designed to meet the demanding requirements of high-performance computing systems. This device, housed in a 1152-pin flip-chip ball grid array (FCBGA) package, boasts a configuration of 644 I/O, enabling robust interfacing and connectivity options. Tailored for engineers and developers needing high-speed, reliable FPGA solutions, the XC2VP30-5FF1152C from AMD Xilinx offers unparalleled flexibility and performance for applications ranging from data processing to industrial automation.
XC2VP30-5FF1152C Features
The XC2VP30-5FF1152C excels in delivering high-speed performance and extensive I/O capabilities, making it an ideal choice for complex digital processing tasks. Features include:
- 644 input/output pins for versatile connections
- 1152FCBGA packaging for efficient space usage and improved thermal characteristics
- High integration suitable for multi-functional systems
XC2VP30-5FF1152C Applications
- Telecommunications Infrastructure:
Utilized in base station development, this FPGA supports advanced signal processing functionalities essential for 5G and other high-speed communication networks.
- Automotive Driver Assistance Systems:
The device's robust processing capabilities enable it to handle multiple inputs and outputs necessary for integrating sensors and actuators in smart vehicle systems.
- Industrial Automation:
Its high I/O count and processing power make the XC2VP30-5FF1152C suitable for controlling complex robotic arms and manufacturing lines, enhancing operational efficiency.
- Consumer Electronics:
Supports the development of sophisticated consumer electronics, such as gaming consoles and high-definition video systems, by handling intensive computational tasks.
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