XC2V3000-4FGG676C
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- Mfr.Part #
- XC2V3000-4FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 484 I/O 676FBGA
- Stock
- 152
- In Stock ：
- 152
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Published :
- 2013
- Operating Supply Voltage :
- 1.5V
- Voltage - Supply :
- 1.425V~1.575V
- Packaging :
- Tray
- Lead Free :
- Lead Free
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Number of Pins :
- 676
- Base Part Number :
- XC2V3000
- Number of Gates :
- 3000000
- Number of LABs/CLBs :
- 3584
- ECCN Code :
- 3A991.D
- Package / Case :
- 676-BGA
- Length :
- 27mm
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 676
- Power Supplies :
- 1.51.5/3.33.3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Registers :
- 28672
- Supply Voltage :
- 1.5V
- Number of I/O :
- 484
- RoHS Status :
- RoHS Compliant
- Speed Grade :
- 4
- Width :
- 27mm
- Number of Outputs :
- 484
- Pbfree Code :
- yes
- RAM Size :
- 216kB
- Clock Frequency :
- 650MHz
- Height Seated (Max) :
- 2.6mm
- Total RAM Bits :
- 1769472
- Terminal Form :
- Ball
- Pin Count :
- 676
- Number of Logic Cells :
- 32256
- Peak Reflow Temperature (Cel) :
- 250
- Terminal Position :
- BOTTOM
- Series :
- Virtex®-II
- Operating Temperature :
- 0°C~85°C TJ
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC2V3000-4FGG676C
FPGAs AMD Xilinx XC2V3000-4FGG676C Overview
The FPGAs AMD Xilinx XC2V3000-4FGG676C represents a high-performance, field-programmable gate array designed for advanced integrated circuits. This IC FPGA by AMD Xilinx boasts an impressive array of 484 I/O options housed within a 676-pin fine-pitch ball grid array (FBGA) package, enabling robust versatility and scalability. The XC2V3000-4FGG676C is engineered to meet the demanding needs of high-throughput applications, offering extensive reprogrammability and integration capabilities that facilitate rapid prototyping and customized hardware configurations. This device is particularly suitable for designers and engineers looking to leverage accelerated development cycles in competitive tech environments.
XC2V3000-4FGG676C Features
The XC2V3000-4FGG676C FPGA includes several key features that enhance its functionality and suitability for complex digital computations. Its 676FBGA package ensures compact integration into various systems, while the extensive 484 I/O options provide flexibility for peripheral connections. The device supports a wide range of digital and mixed-signal applications, highlighting its adaptability across different technological landscapes.
XC2V3000-4FGG676C Applications
- Telecommunications: Utilized in routers and switches, the XC2V3000-4FGG676C manages high-speed signal processing tasks, enabling efficient data flow and connectivity in network infrastructure.
- Automotive Systems: Critical for driver assistance systems, this FPGA processes multiple real-time inputs from automotive sensors to enhance vehicle safety and performance.
- Consumer Electronics: Embedded in devices like high-definition televisions and gaming consoles, the XC2V3000-4FGG676C enhances graphical output and computing power, ensuring seamless user experiences.
- Industrial Automation: In factory settings, this FPGA helps in the control systems, managing operational sequences and robotic actions to increase manufacturing precision and efficiency.
- Medical Devices: Vital for medical imaging equipment, such as MRI and ultrasound machines, the XC2V3000-4FGG676C processes complex datasets to produce accurate and detailed images that are crucial for diagnostics.
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