XC2S300E-6FTG256C
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- Mfr.Part #
- XC2S300E-6FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 182 I/O 256FTBGA
- Stock
- 9,207
- In Stock ：
- 9,207
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Lead Free
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Package / Case :
- 256-LBGA
- Clock Frequency :
- 357MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mount :
- Surface Mount
- Series :
- Spartan®-IIE
- Number of Gates :
- 300000
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 1.71V~1.89V
- Number of Terminations :
- 256
- Number of Pins :
- 256
- RAM Size :
- 8kB
- Operating Supply Voltage :
- 1.8V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 260
- Total RAM Bits :
- 65536
- JESD-609 Code :
- e1
- Published :
- 2001
- Number of Logic Elements/Cells :
- 6912
- Speed Grade :
- 6
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XC2S300E
- Height Seated (Max) :
- 2mm
- Radiation Hardening :
- No
- ECCN Code :
- EAR99
- Number of Outputs :
- 329
- Terminal Pitch :
- 1mm
- Number of Equivalent Gates :
- 93000
- Pbfree Code :
- yes
- Number of I/O :
- 182
- Length :
- 17mm
- Pin Count :
- 256
- Supply Voltage :
- 1.8V
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Number of LABs/CLBs :
- 1536
- Width :
- 17mm
- Packaging :
- Tray
- Datasheets
- XC2S300E-6FTG256C
FPGAs AMD Xilinx XC2S300E-6FTG256C Overview
The FPGAs AMD Xilinx XC2S300E-6FTG256C represents a pinnacle of technological innovation in the field of programmable logic devices. Designed by AMD Xilinx, this high-performance Field Programmable Gate Array (FPGA) is crafted to meet the rigorous demands of modern digital circuits. The XC2S300E-6FTG256C is housed in a 256-pin fine-pitch Ball Grid Array (FBGA) package, offering a robust platform for advanced digital applications with its 182 programmable I/O ports. This device is ideally suited for designers looking to harness the flexibility of programmable logic while achieving high-speed signal processing and data manipulation.
XC2S300E-6FTG256C Features
The XC2S300E-6FTG256C from AMD Xilinx boasts a range of features designed to optimize performance and ease of integration. Key features include:
- High I/O count with 182 programmable input/output ports for versatile connectivity.
- Compact 256FTBGA packaging enables dense integration in space-constrained applications.
- High-performance logic capabilities suitable for complex digital processing tasks.
- Support for multiple design configurations, enhancing design reuse and accelerating time-to-market.
XC2S300E-6FTG256C Applications
- Telecommunications Infrastructure:
Utilized in routers, switches, and base stations to manage data flow efficiently and ensure robust communication networks.
- Consumer Electronics:
Integral in the development of consumer devices such as digital cameras and gaming consoles, enhancing user experience through high-speed processing capabilities.
- Automotive Systems:
Applied in vehicle safety and control systems, enabling advanced driver-assistance systems (ADAS) and infotainment systems.
- Industrial Automation:
Helps in managing complex control systems in manufacturing processes, increasing productivity and reliability in industrial settings.
- Medical Devices:
Key in medical imaging systems and diagnostic equipment, ensuring fast processing of complex algorithms critical for patient care.
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