XC2S200E-6FGG456C
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- Mfr.Part #
- XC2S200E-6FGG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 289 I/O 456FBGA
- Stock
- 839
- In Stock ：
- 839
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 250
- Number of Equivalent Gates :
- 52000
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- ECCN Code :
- 3A991.D
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Package / Case :
- 456-BBGA
- Number of Pins :
- 456
- Width :
- 23mm
- Total RAM Bits :
- 57344
- Published :
- 2008
- Length :
- 23mm
- Base Part Number :
- XC2S200E
- Voltage - Supply :
- 1.71V~1.89V
- Packaging :
- Tray
- Speed Grade :
- 6
- Number of LABs/CLBs :
- 1176
- JESD-609 Code :
- e1
- Additional Feature :
- MAXIMUM USABLE GATES = 150000
- Terminal Pitch :
- 1mm
- Number of Gates :
- 200000
- Number of CLBs :
- 864
- Supply Voltage :
- 1.8V
- Series :
- Spartan®-IIE
- Number of Terminations :
- 456
- Number of Logic Elements/Cells :
- 5292
- RAM Size :
- 7kB
- Operating Temperature :
- 0°C~85°C TJ
- Operating Supply Voltage :
- 1.8V
- RoHS Status :
- RoHS Compliant
- Pin Count :
- 456
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Radiation Hardening :
- No
- Number of I/O :
- 289
- Pbfree Code :
- yes
- Number of Outputs :
- 289
- Lead Free :
- Lead Free
- Clock Frequency :
- 357MHz
- Datasheets
- XC2S200E-6FGG456C
FPGAs AMD Xilinx XC2S200E-6FGG456C Overview
The FPGAs AMD Xilinx XC2S200E-6FGG456C is a high-performance, field-programmable gate array designed for advanced digital processing applications. This FPGA stands out due to its robust configuration options and versatile functionality, making it a prime choice for developers and engineers looking to push the boundaries of hardware acceleration. With its 456-pin fine-pitch ball grid array (FBGA) packaging, this device ensures a compact footprint while providing ample I/O capabilities with 289 programmable input/output ports. This balance of size and capacity makes the XC2S200E-6FGG456C particularly suited for both space-constrained applications and high-volume data management systems.
XC2S200E-6FGG456C Features
This FPGA features a dynamic and flexible architecture that supports a wide range of applications, thanks to its programmable logic cells and high I/O pin count. The integrated design tools from AMD Xilinx allow for streamlined development, optimizing both time-to-market and operational efficiency. The device also supports multiple logic configurations, enabling re-programmability and on-the-fly adjustments which are crucial for iterative development and prototyping in high-tech industries.
XC2S200E-6FGG456C Applications
- Telecommunications: Used in networking equipment to manage data flow and signal processing efficiently, enhancing broadband and mobile network capabilities.
- Automotive Systems: Integrates into driver assistance systems where real-time data processing and decision-making are critical for vehicle safety and performance enhancements.
- Consumer Electronics: Serves as a core component in high-definition multimedia interfaces (HDMI) and video processing units, providing the necessary computation power and connectivity for seamless media delivery and display.
- Industrial Automation: Applied in control systems for real-time processing of sensor data and machine control, thereby increasing the efficiency and reliability of automated production lines.
- Medical Devices: Utilized in diagnostic and imaging equipment, enabling complex computational tasks required for real-time imaging and patient monitoring systems.
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