XC2S100E-6FTG256C
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- Mfr.Part #
- XC2S100E-6FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 182 I/O 256FTBGA
- Stock
- 16,112
- In Stock ：
- 16,112
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Lead Free
- Peak Reflow Temperature (Cel) :
- 260
- HTS Code :
- 8542.39.00.01
- Width :
- 17mm
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 600
- Package / Case :
- 256-LBGA
- Operating Temperature :
- 0°C~85°C TJ
- Number of Logic Elements/Cells :
- 2700
- Number of Outputs :
- 202
- Base Part Number :
- XC2S100E
- Series :
- Spartan®-IIE
- Number of Equivalent Gates :
- 37000
- Number of CLBs :
- 600
- Height Seated (Max) :
- 2mm
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Number of Pins :
- 256
- Number of I/O :
- 182
- Voltage - Supply :
- 1.71V~1.89V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Published :
- 2008
- JESD-609 Code :
- e1
- Pin Count :
- 256
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Speed Grade :
- 6
- Radiation Hardening :
- No
- RAM Size :
- 5kB
- Number of Terminations :
- 256
- Packaging :
- Tray
- Supply Voltage :
- 1.8V
- RoHS Status :
- RoHS Compliant
- Length :
- 17mm
- Clock Frequency :
- 357MHz
- Total RAM Bits :
- 40960
- Pbfree Code :
- yes
- Number of Gates :
- 100000
- Terminal Form :
- Ball
- Mount :
- Surface Mount
- Operating Supply Voltage :
- 1.8V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Pitch :
- 1mm
- Datasheets
- XC2S100E-6FTG256C
FPGAs AMD Xilinx XC2S100E-6FTG256C Overview
The AMD Xilinx XC2S100E-6FTG256C is a high-performance, field-programmable gate array (FPGA) designed for versatile applications across various industries. As part of the robust Spartan-II series, this FPGA is optimized for performance and cost, making it an ideal choice for developers looking to balance functionality with budget. With a compact form factor in a 256-pin fine-pitch ball grid array (FBGA) package, it integrates seamlessly into systems where space and power efficiency are critical. This specific model features 182 user I/O pins, allowing extensive interfacing with a wide range of peripherals and devices, supporting complex digital systems with reduced development time and increased flexibility.
XC2S100E-6FTG256C Features
This FPGA model boasts several key features that make it stand out in the crowded field of programmable logic devices. These include its high I/O pin count, a low-power 2.5V core, in-system programmability, and support for advanced digital signal processing. Its compatibility with Xilinx's ISE software tools ensures that system design and deployment can be streamlined and optimized for maximum efficiency. The XC2S100E-6FTG256C also supports a variety of logic densities, giving developers the flexibility to scale projects as needed without a complete redesign.
XC2S100E-6FTG256C Applications
- Telecommunications: Utilized in communication infrastructure to manage signal processing tasks, enhancing data transmission rates and reliability.
- Consumer Electronics: Integrated into devices such as high-definition televisions and digital cameras for managing video and image processing tasks, providing higher quality outputs and enhanced user experiences.
- Automotive Systems: Used in vehicle control systems to perform critical functions, including sensor data processing and real-time decision-making, enhancing vehicle safety and performance.
- Industrial Automation: Employs robust processing capabilities to control machinery, optimize automation processes, and increase production efficiency in industrial settings.
- Medical Devices: Key component in diagnostic equipment where precision and reliability are crucial, facilitating advanced health monitoring and therapeutic functions.
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