XA7Z010-1CLG400I
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- Mfr.Part #
- XA7Z010-1CLG400I
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 400BGA
- Stock
- 4,795
- In Stock ：
- 4,795
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- HTS Code :
- 8542.39.00.01
- Surface Mount :
- yes
- Package / Case :
- 400-LFBGA, CSPBGA
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Primary Attributes :
- Artix™-7 FPGA, 28K Logic Cells
- Terminal Form :
- Ball
- Peripherals :
- DMA
- ECCN Code :
- EAR99
- Qualification Status :
- Not Qualified
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Length :
- 17mm
- Power Supplies :
- 11.8V
- Data Bus Width :
- 32b
- RAM Size :
- 256KB
- Terminal Pitch :
- 0.8mm
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Series :
- Automotive, AEC-Q100, Zynq®-7000 XA
- Factory Lead Time :
- 10 Weeks
- Frequency :
- 667MHz
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Core Architecture :
- ARM
- Number of I/O :
- 130
- Architecture :
- MCU, FPGA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2010
- UV Erasable :
- N
- Height Seated (Max) :
- 1.6mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- RoHS Status :
- ROHS3 Compliant
- Interface :
- CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- JESD-609 Code :
- e1
- Number of Pins :
- 400
- Packaging :
- Tray
- Number of Terminations :
- 400
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XA7Z010-1CLG400I
400 Terminations -40°C~100°C TJ 400 Pin System On Chip Automotive, AEC-Q100, Zynq®-7000 XA Series 130 I/O
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 400-LFBGA, CSPBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Automotive, AEC-Q100, Zynq®-7000 XA series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Artix™-7 FPGA, 28K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.Having 400 terminations in total makes system on a chip possible.You will need to provide 11.8V power supplies in order to run system on chip.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.667MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Currently, the computer SoC is available in a 400-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z010-1CLG400I System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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