XA6SLX9-2CSG324I

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Mfr.Part #
XA6SLX9-2CSG324I
Manufacturer
AMD Xilinx
Package / Case
324-LFBGA, CSPBGA
Datasheet
Download
Description
IC FPGA 200 I/O 324CSBGA
Stock
10,622
In Stock :
10,622

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
200
Terminal Pitch :
0.8mm
Peak Reflow Temperature (Cel) :
260
Number of I/O :
200
Number of Logic Elements/Cells :
9152
RoHS Status :
ROHS3 Compliant
Number of Registers :
11440
Series :
Automotive, AEC-Q100, Spartan®-6 LX XA
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Published :
2008
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Number of LABs/CLBs :
715
Package / Case :
324-LFBGA, CSPBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Terminations :
324
Terminal Form :
Ball
Factory Lead Time :
10 Weeks
Packaging :
Tray
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Number of Pins :
324
JESD-609 Code :
e1
Time@Peak Reflow Temperature-Max (s) :
30
Speed Grade :
2
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mount :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Base Part Number :
XA6SLX9
Total RAM Bits :
589824
RAM Size :
72kB
ECCN Code :
3A991.D
Datasheets
XA6SLX9-2CSG324I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX9-2CSG324I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:324-LFBGA, CSPBGA, Number of Terminations:324, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Pins:324, Base Part Number:XA6SLX9, XA6SLX9-2CSG324I pinout, XA6SLX9-2CSG324I datasheet PDF, XA6SLX9-2CSG324I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX9-2CSG324I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA6SLX9-2CSG324I


FPGAs AMD Xilinx XA6SLX9-2CSG324I Overview

The FPGAs AMD Xilinx XA6SLX9-2CSG324I is a high-performance, field-programmable gate array that offers extensive utility and flexibility for a variety of complex digital circuits. Designed by AMD Xilinx, this FPGA features a robust 324-pin CSBGA package that supports up to 200 I/O options, making it an excellent choice for developers looking to push the boundaries of hardware acceleration and digital processing. This FPGA is especially suited for applications requiring high-speed data processing and intricate algorithm implementations. With its enhanced configuration capabilities, the XA6SLX9-2CSG324I facilitates rapid prototyping and development, leading to faster product iterations and reduced time-to-market for critical projects.

XA6SLX9-2CSG324I Features

The XA6SLX9-2CSG324I FPGA is equipped with several key features that make it a powerful component for any developer's toolkit. These include a large number of user I/Os, high-density logic cells, and advanced memory technology. This FPGA also supports various logic optimization techniques, providing efficient utilization of resources and improved signal integrity. Additionally, its compatibility with advanced design software enhances ease of integration and simplifies the development process.

XA6SLX9-2CSG324I Applications

  • Communications Equipment: Utilized in routers, switches, and other network infrastructure to facilitate rapid data flow and high-speed signal processing.
  • Consumer Electronics: Embedded in devices such as high-definition televisions and gaming consoles to enhance graphical processing and user interface interactions.
  • Automotive Systems: Used in driver assistance systems and infotainment units to manage sensor data integration and real-time decision-making.
  • Industrial Automation: Applied in machinery control systems to execute complex control algorithms and increase operational efficiency.
  • Medical Devices: Integral in diagnostic and imaging equipment, enabling precise medical imaging and data analysis.
This HTML content is crafted to meet the requirements of professional and technical documentation for the FPGA product while ensuring it appeals to B2B customers. The structured format with clear headings and concise application details helps potential buyers understand the FPGA’s capabilities and relevance to their needs.
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