XA6SLX75-2FGG484Q

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Mfr.Part #
XA6SLX75-2FGG484Q
Manufacturer
AMD Xilinx
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 280 I/O 484FBGA
Stock
27,232
In Stock :
27,232

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Pitch :
1mm
ECCN Code :
3A991.D
Terminal Position :
BOTTOM
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Number of LABs/CLBs :
5831
Number of Outputs :
280
Number of Registers :
93296
Packaging :
Tray
Factory Lead Time :
10 Weeks
Number of Pins :
484
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
484-BBGA
Base Part Number :
XA6SLX75
Operating Temperature :
-40°C~125°C TJ
Number of I/O :
280
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) :
30
Number of Terminations :
484
Qualification Status :
Not Qualified
Terminal Form :
Ball
Speed Grade :
2
Peak Reflow Temperature (Cel) :
250
Total RAM Bits :
3170304
Voltage - Supply :
1.14V~1.26V
Mounting Type :
Surface Mount
Series :
Automotive, AEC-Q100, Spartan®-6 LX XA
Published :
2008
Operating Supply Voltage :
1.2V
RAM Size :
387kB
Number of Logic Elements/Cells :
74637
JESD-609 Code :
e1
Datasheets
XA6SLX75-2FGG484Q
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX75-2FGG484Q from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:484, Package / Case:484-BBGA, Base Part Number:XA6SLX75, Operating Temperature:-40°C~125°C TJ, Number of Terminations:484, Mounting Type:Surface Mount, XA6SLX75-2FGG484Q pinout, XA6SLX75-2FGG484Q datasheet PDF, XA6SLX75-2FGG484Q amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX75-2FGG484Q ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA6SLX75-2FGG484Q


FPGAs AMD Xilinx XA6SLX75-2FGG484Q Overview

The AMD Xilinx XA6SLX75-2FGG484Q FPGA represents a cutting-edge component in the field of programmable logic devices. Designed for flexibility and high performance, this IC is optimized for system integration that demands robust data processing and high-speed interfaces. Its substantial I/O capabilities and advanced processing power make it an ideal choice for designers looking to push the boundaries of technology in various high-tech applications. Leveraging the renowned Xilinx technology, the XA6SLX75-2FGG484Q FPGA is built to meet the rigorous requirements of modern digital circuits, offering a reliable platform for developing complex and efficient systems.

XA6SLX75-2FGG484Q Features

This FPGA from AMD Xilinx features 280 I/O pins housed in a compact 484-ball fine-pitch BGA (FBGA) package, allowing for dense and flexible board designs. The device is designed for optimal power efficiency and high-speed signal processing, making it an excellent choice for applications requiring rapid data throughput and extensive connectivity.

XA6SLX75-2FGG484Q Applications

  • Telecommunications: Employed in routers and switching systems to manage data flow efficiently across networks.
  • Automotive: Integral in driver assistance systems where rapid data processing is critical for real-time decision-making.
  • Industrial: Used in control systems that require high levels of data integrity and operational reliability.
  • Consumer Electronics: Provides the processing power necessary for advanced user interfaces and multimedia experiences in smart devices.
  • Medical Devices: Critical for imaging systems and diagnostic instruments where precise and quick processing is essential.
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