W66CP2NQUAFJ

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Organization :

128 M x 32

Memory Type :

Volatile

Maximum Operating Temperature :

+ 105 C

Subcategory :

Memory and Data Storage

Package :

Tray

Operating Temperature :

-40°C ~ 105°C (TC)

Series :

-

Data Bus Width :

32 bit

Write Cycle Time - Word, Page :

-

Product Type :

DRAM

Type :

SDRAM - LPDDR4

Supplier Device Package :

200-WFBGA (10x14.5)

Memory Format :

DRAM

Mounting Type :

Surface Mount

Memory Interface :

LVSTL_11

Access Time :

3.5 ns

Minimum Operating Temperature :

- 40 C

Memory Organization :

128M x 32

Packaging :

Tray

RoHS :

Details

Product Category :

DRAM

Voltage - Supply :

1.06V ~ 1.17V, 1.7V ~ 1.95V

Brand :

Winbond

Clock Frequency :

2.133 GHz

Base Product Number :

W66CP2

Package / Case :

200-WFBGA

Product Status :

Active

Manufacturer :

Winbond

Memory Size :

4Gbit

Mounting Style :

SMD/SMT