W25X16VSFIG

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Terminal Position :

Dual

Peak Reflow Temperature (Cel) :

260

Qualification Status :

Not Qualified

JESD-30 Code :

R-PDSO-G16

Packaging :

Tube

HTS Code :

8542.32.00.51

Write Cycle Time - Word, Page :

3ms

Reach Compliance Code :

Unknown

Memory Size :

16Mb 2M x 8

Operating Temperature :

-40°C~85°C TA

Length :

10.285mm

Operating Mode :

SYNCHRONOUS

Interface :

SPI, Serial

Programming Voltage :

2.7V

Width :

7.49mm

Time@Peak Reflow Temperature-Max (s) :

40

Memory Density :

16777216 bit

Number of Terminations :

16

Published :

2007

ECCN Code :

EAR99

Mounting Type :

Surface Mount

Memory Interface :

SPI

Endurance :

100000 Write/Erase Cycles

Supply Voltage-Max (Vsup) :

3.6V

Memory Type :

Non-Volatile

Series :

SpiFlash®

Terminal Finish :

MATTE TIN

Supply Voltage-Min (Vsup) :

2.7V

Clock Frequency :

75MHz

Write Protection :

HARDWARE/SOFTWARE

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Pitch :

1.27mm

Data Retention Time-Min :

20

Supply Voltage :

3V

Surface Mount :

yes

Standby Current-Max :

0.00001A

Serial Bus Type :

SPI

Power Supplies :

3/3.3V

Memory Format :

Flash

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

2.64mm

Supply Current-Max :

0.018mA

Pin Count :

16

Organization :

2MX8

Voltage - Supply :

2.7V~3.6V

Number of Functions :

1

JESD-609 Code :

e3

Package / Case :

16-SOIC (0.295, 7.50mm Width)

Memory Width :

8