W25Q257FVFIG

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Mfr.Part #
W25Q257FVFIG
Manufacturer
Winbond Electronics Corporation
Package / Case
16-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC FLASH 256MBIT SPI/QUAD 16SOIC
Stock
1,054
In Stock :
1,054

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Manufacturer :
Winbond Electronics Corporation
Product Category :
Memory
Memory Interface :
SPI - Quad I/O, QPI
Programming Voltage :
3V
Operating Temperature :
-40°C~85°C TA
Terminal Position :
Dual
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Clock Frequency :
104MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
SpiFlash®
Number of Terminations :
16
Voltage - Supply :
2.7V~3.6V
Memory Density :
268435456 bit
Organization :
256MX1
Write Cycle Time - Word, Page :
50μs, 3ms
JESD-30 Code :
R-PDSO-G16
Terminal Pitch :
1.27mm
Memory Size :
256Mb 32M x 8
Operating Mode :
SYNCHRONOUS
Parallel/Serial :
Serial
Supply Voltage :
3V
Length :
10.31mm
Supply Voltage-Min (Vsup) :
2.7V
Width :
7.49mm
Factory Lead Time :
14 Weeks
Number of Functions :
1
Packaging :
Tube
Package / Case :
16-SOIC (0.295, 7.50mm Width)
Supply Voltage-Max (Vsup) :
3.6V
Memory Type :
Non-Volatile
Height Seated (Max) :
2.64mm
Surface Mount :
yes
Memory Width :
1
Memory Format :
Flash
Datasheets
W25Q257FVFIG
Introducing Memory Winbond Electronics Corporation W25Q257FVFIG from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Terminations:16, Package / Case:16-SOIC (0.295, 7.50mm Width), W25Q257FVFIG pinout, W25Q257FVFIG datasheet PDF, W25Q257FVFIG amp .Beyond Memory Winbond Electronics Corporation W25Q257FVFIG ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Winbond Electronics Corporation W25Q257FVFIG


Memory Winbond Electronics Corporation W25Q257FVFIG Overview

The Memory Winbond Electronics Corporation W25Q257FVFIG is a high-capacity 256Mbit flash memory chip that offers a reliable and efficient storage solution for a broad range of applications. Manufactured by Winbond Electronics Corporation, this IC utilizes advanced SPI/Quad interface technology encapsulated in a 16SOIC package, providing optimal performance for both sequential and random data access. Designed for high-speed operations, it supports the rigorous demands of modern electronic devices, making it ideal for sectors requiring large memory capacities and swift data management capabilities.

W25Q257FVFIG Features

The W25Q257FVFIG flash memory boasts several key features that make it stand out. It supports Quad-SPI, which enables it to offer faster data throughput compared to traditional serial peripheral interface modes. Additionally, it is equipped with a 256Mbit memory size, which is ample for complex applications and data-intensive operations. The IC's 16SOIC narrow package is designed for compact PCB layouts, making it suitable for space-constrained applications while ensuring reliability and durability in varied environmental conditions.

W25Q257FVFIG Applications

  • Mobile Devices: Used in smartphones and tablets to enhance the storage of user data and application caching, ensuring swift device performance and responsiveness.
  • Consumer Electronics: Integral in devices such as digital cameras and gaming consoles, where it provides high-speed data access and storage for user settings, game data, and high-resolution images.
  • Automotive Systems: Applies in advanced driver-assistance systems (ADAS) and infotainment systems, enabling fast data logging and efficient firmware updates, crucial for performance and safety.
  • Industrial Automation: Utilized in machine control systems for logging data, updating system firmware, and managing complex operations, thereby enhancing industrial efficiency and reliability.
  • Internet of Things (IoT) Devices: Plays a critical role in IoT applications by storing firmware and operational parameters, facilitating rapid data access and secure storage across a range of connected devices.
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