W25Q256FVCBQ

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Package :

Tube

Temperature Grade :

Industrial

Seated Height-Max :

1.2 mm

Memory Width :

1

Number of Functions :

1

Terminal Position :

BOTTOM

Access Time :

7 ns

Length :

8 mm

Package / Case :

24-TBGA

Surface Mount :

yes

Supply Voltage-Max (Vsup) :

3.6 V

JESD-30 Code :

R-PBGA-B24

Memory Type :

Non-Volatile

Width :

6 mm

Programming Voltage :

3 V

Mounting Type :

Surface Mount

Memory IC Type :

Flash

Memory Format :

Flash

Clock Frequency :

104 MHz

Memory Size :

256Mbit

Voltage - Supply :

2.7V ~ 3.6V

ECCN Code :

3A991.B.1.A

Supply Voltage-Min (Vsup) :

2.7 V

Number of Terminals :

24

Type :

NOR TYPE

HTS Code :

8542.32.00.51

Base Product Number :

W25Q256

Reach Compliance Code :

Compliant

Memory Interface :

SPI - Quad I/O, QPI

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Series :

SpiFlash®

Number of Words :

268435456 words

Product Status :

Obsolete

Terminal Form :

Ball

Parallel/Serial :

Serial

Write Cycle Time - Word, Page :

50μs, 3ms

Operating Temperature :

-40°C ~ 85°C (TA)

Terminal Pitch :

1 mm

Memory Organization :

32M x 8

Organization :

256MX1

Package Shape :

RECTANGULAR

Operating Mode :

SYNCHRONOUS

Supplier Device Package :

24-TFBGA (6x8)

Memory Density :

268435456 bit