VSC8502XML

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Mfr.Part #
VSC8502XML
Manufacturer
Microchip Technology
Package / Case
QFN
Datasheet
Download
Description
IC TELECOM INTERFACE 135QFN
Stock
1,052
In Stock :
1,052

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Number of Circuits :
1
Package :
Tray
Product Status :
Active
Standard :
10/100/1GBASE-T
Package Type :
QFN
Min Operating Temperature :
0°C
Interface :
Ethernet
Factory Lead Time :
7 Weeks
Screening Level :
COMMERCIAL
Reach Compliance Code :
Compliant
Manufacturer :
Microchip
Number of Channels per Chip :
2
Integrated CDR :
No
Operating Supply Voltage (Typ) :
3.3(V)
Width :
12 mm
Package / Case :
QFN
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Seated Height-Max :
0.85 mm
Series :
VSC8502
Mounting :
Surface Mount
Terminal Pitch :
0.65 mm
Data Rate :
1 Gbps
Telecom IC Type :
TELECOM CIRCUIT
Standard Supported :
10 Base-T/100 Base-TX/1000 Base-T
Terminal Form :
Ball
Temperature Grade :
Automotive
JESD-30 Code :
S-PBGA-B135
Mounting Type :
Surface Mount
Pin Count :
135
Maximum Data Rate :
1000 Mbps
Maximum Operating Temperature :
+ 125 C
Number of Channels :
1
Package Shape :
Square
Supplier Package :
QFN
Packaging :
Tray
Number of Functions :
1
Operating Temperature :
0 to 125 °C
Minimum Operating Temperature :
0 C
Product Type :
Ethernet ICs
Terminal Position :
BOTTOM
Number of Terminals :
135
Function :
Ethernet
Surface Mount :
yes
PHY Line Side Interface :
yes
RoHS :
Details
JTAG Support :
No
Subcategory :
Communication and Networking ICs
Current - Supply :
-
Number of Transceivers :
2 Transceiver
Mounting Style :
SMD/SMT
Operating Temperature (Min) :
0C
Rad Hardened :
No
Length :
12 mm
Supplier Device Package :
135-QFN (12x12)
Brand :
Microchip Technology / Atmel
Interface Type :
RGMII/GMII
Operating Supply Voltage :
1.2, 1.8 V
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
3.3V
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Operating Temperature (Max) :
125C
Product :
Ethernet Transceivers
Product Category :
Ethernet ICs
Max Operating Temperature :
125°C
Base Product Number :
VSC8502
Datasheets
VSC8502XML
Introducing Telecom Microchip Technology VSC8502XML from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:QFN, Mounting Type:Surface Mount, Number of Channels:1, Operating Temperature:0 to 125 °C, VSC8502XML pinout, VSC8502XML datasheet PDF, VSC8502XML amp .Beyond Telecom Microchip Technology VSC8502XML ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology VSC8502XML


Telecom Microchip Technology VSC8502XML Overview

Discover the pinnacle of telecom interface integration with the VSC8502XML by Microchip Technology. Designed to revolutionize telecommunications, this IC presents a seamless blend of cutting-edge technology and unparalleled performance. As a leading solution in the telecom industry, the VSC8502XML sets a new standard for reliability, efficiency, and versatility.

With its advanced features and robust construction, this telecom interface IC caters to the diverse needs of modern communication systems, offering seamless integration and enhanced functionality. Whether deployed in networking equipment, data centers, or telecommunications infrastructure, the VSC8502XML delivers exceptional performance, enabling businesses to stay ahead in today's dynamic marketplace.

VSC8502XML Features

  • Integrated telecom interface
  • 135QFN package
  • Microchip Technology reliability
  • Advanced performance
  • Efficient design
  • Versatile applications

VSC8502XML Applications

  • Networking Equipment: The VSC8502XML serves as the backbone of networking equipment, facilitating seamless communication between devices in data centers, enterprise networks, and telecommunications infrastructure.
  • Data Centers: In data center environments, the VSC8502XML optimizes connectivity and reliability, ensuring uninterrupted communication and efficient data transmission.
  • Telecommunications Infrastructure: As a key component of telecommunications infrastructure, this IC enables the efficient transfer of data and voice signals, supporting high-speed communication networks and telephony systems.
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