VSC8502XML

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Mfr.Part #
VSC8502XML
Manufacturer
Microchip Technology
Package / Case
QFN
Datasheet
Download
Description
IC TELECOM INTERFACE 135QFN
Stock
1,052
In Stock :
1,052

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Voltage - Supply :
3.3V
Number of Functions :
1
Manufacturer :
Microchip
Product :
Ethernet Transceivers
Interface :
Ethernet
Seated Height-Max :
0.85 mm
Product Status :
Active
Subcategory :
Communication and Networking ICs
Package Shape :
Square
Mounting Style :
SMD/SMT
Number of Terminals :
135
Operating Temperature (Min) :
0C
Number of Circuits :
1
Series :
VSC8502
Product Type :
Ethernet ICs
Screening Level :
COMMERCIAL
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.2, 1.8 V
Package Type :
QFN
Reach Compliance Code :
Compliant
Base Product Number :
VSC8502
Rad Hardened :
No
Operating Supply Voltage (Typ) :
3.3(V)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Supplier Package :
QFN
Packaging :
Tray
Supplier Device Package :
135-QFN (12x12)
Min Operating Temperature :
0°C
Surface Mount :
yes
Width :
12 mm
Max Operating Temperature :
125°C
Mounting :
Surface Mount
Package / Case :
QFN
Maximum Operating Temperature :
+ 125 C
Standard Supported :
10 Base-T/100 Base-TX/1000 Base-T
Pin Count :
135
Terminal Pitch :
0.65 mm
Operating Temperature :
0 to 125 °C
Factory Lead Time :
7 Weeks
RoHS :
Details
JTAG Support :
No
Number of Transceivers :
2 Transceiver
Current - Supply :
-
Product Category :
Ethernet ICs
PHY Line Side Interface :
yes
Number of Channels :
1
Maximum Data Rate :
1000 Mbps
Data Rate :
1 Gbps
Package :
Tray
Terminal Position :
BOTTOM
Interface Type :
RGMII/GMII
Standard :
10/100/1GBASE-T
Telecom IC Type :
TELECOM CIRCUIT
Number of Channels per Chip :
2
Operating Temperature (Max) :
125C
Integrated CDR :
No
Minimum Operating Temperature :
0 C
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PBGA-B135
Length :
12 mm
Function :
Ethernet
Temperature Grade :
Automotive
Terminal Form :
Ball
Brand :
Microchip Technology / Atmel
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Datasheets
VSC8502XML
Introducing Telecom Microchip Technology VSC8502XML from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:QFN, Operating Temperature:0 to 125 °C, Number of Channels:1, VSC8502XML pinout, VSC8502XML datasheet PDF, VSC8502XML amp .Beyond Telecom Microchip Technology VSC8502XML ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology VSC8502XML


Telecom Microchip Technology VSC8502XML Overview

Discover the pinnacle of telecom interface integration with the VSC8502XML by Microchip Technology. Designed to revolutionize telecommunications, this IC presents a seamless blend of cutting-edge technology and unparalleled performance. As a leading solution in the telecom industry, the VSC8502XML sets a new standard for reliability, efficiency, and versatility.

With its advanced features and robust construction, this telecom interface IC caters to the diverse needs of modern communication systems, offering seamless integration and enhanced functionality. Whether deployed in networking equipment, data centers, or telecommunications infrastructure, the VSC8502XML delivers exceptional performance, enabling businesses to stay ahead in today's dynamic marketplace.

VSC8502XML Features

  • Integrated telecom interface
  • 135QFN package
  • Microchip Technology reliability
  • Advanced performance
  • Efficient design
  • Versatile applications

VSC8502XML Applications

  • Networking Equipment: The VSC8502XML serves as the backbone of networking equipment, facilitating seamless communication between devices in data centers, enterprise networks, and telecommunications infrastructure.
  • Data Centers: In data center environments, the VSC8502XML optimizes connectivity and reliability, ensuring uninterrupted communication and efficient data transmission.
  • Telecommunications Infrastructure: As a key component of telecommunications infrastructure, this IC enables the efficient transfer of data and voice signals, supporting high-speed communication networks and telephony systems.
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