TSV6390ICT
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- Mfr.Part #
- TSV6390ICT
- Manufacturer
- STMicroelectronics
- Package / Case
- 6-TSSOP, SC-88, SOT-363
- Datasheet
- Download
- Description
- IC OPAMP GP 1 CIRCUIT SC70-6
- Stock
- 42,828
- In Stock ：
- 42,828
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- Manufacturer :
- STMicroelectronics
- Product Category :
- Instrumentation, OP Amps, Buffer Amps
- Pin Count :
- 6
- Output Current :
- 72mA
- Unity Gain BW-Nom :
- 2000 kHz
- Output Type :
- Rail-to-Rail
- Low-Bias :
- yes
- Architecture :
- VOLTAGE-FEEDBACK
- Operating Supply Current :
- 60μA
- Bandwidth :
- 2.4MHz
- Base Part Number :
- TSV6390
- Common Mode Rejection Ratio :
- 60 dB
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage Limit-Max :
- 6V
- Number of Pins :
- 6
- Mounting Type :
- Surface Mount
- Input Offset Voltage (Vos) :
- 3mV
- Operating Temperature :
- -40°C~125°C
- Height :
- 1mm
- Supply Voltage :
- 1.8V
- Voltage - Supply, Single/Dual (±) :
- 1.5V~5.5V
- Power :
- No
- Packing Method :
- Tape and Reel
- Voltage Gain :
- 98dB
- Number of Terminations :
- 6
- Micropower :
- yes
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Package / Case :
- 6-TSSOP, SC-88, SOT-363
- Number of Functions :
- 1
- Terminal Position :
- Dual
- Low-Offset :
- No
- Lifecycle Status :
- ACTIVE (Last Updated: 7 months ago)
- Lead Free :
- Lead Free
- REACH SVHC :
- No SVHC
- Frequency Compensation :
- yes
- Nominal Supply Current :
- 60μA
- RoHS Status :
- ROHS3 Compliant
- Amplifier Type :
- GENERAL PURPOSE
- Slew Rate :
- 1.1V/μs
- Peak Reflow Temperature (Cel) :
- 260
- Output Current per Channel :
- 72mA
- Mount :
- Surface Mount
- Packaging :
- Tape and Reel (TR)
- Factory Lead Time :
- 12 Weeks
- JESD-609 Code :
- e3
- Terminal Form :
- Gull wing
- Radiation Hardening :
- No
- Length :
- 2.2mm
- Number of Channels :
- 1
- Width :
- 1.35mm
- Current - Input Bias :
- 1pA
- ECCN Code :
- EAR99
- Datasheets
- TSV6390ICT
[Instrumentation, OP Amps, Buffer Amps - STMicroelectronics TSV6390ICT] Overview
Introducing the cutting-edge TSV6390ICT by STMicroelectronics, a leading name in integrated circuits technology. This IC OPAMP GP 1 CIRCUIT SC706 stands at the forefront of innovation, offering unparalleled performance and versatility in the realm of instrumentation, operational amplifiers, and buffer amplifiers.
Designed to meet the demanding requirements of modern electronic applications, this compact yet powerful device boasts a myriad of features tailored to optimize circuit performance and ensure reliable operation in diverse scenarios.
With its robust construction and advanced functionality, the TSV6390ICT redefines the standards of excellence in the field, making it the preferred choice for professionals and enthusiasts alike.
TSV6390ICT Features
- High Precision: Delivers exceptional accuracy and stability for precise measurements in instrumentation applications.
- Wide Bandwidth: Offers a broad frequency range, enabling efficient signal processing in various electronic circuits.
- Low Power Consumption: Optimized power management ensures energy efficiency, prolonging battery life in portable devices.
- Enhanced Reliability: Built to withstand harsh operating conditions, ensuring long-term performance and durability.
- Compact Design: Space-saving form factor facilitates integration into compact electronic systems without compromising functionality.
- Flexible Configuration: Versatile configuration options enable customization to suit specific application requirements.
TSV6390ICT Applications
- Industrial Automation: Utilized in process control systems and machinery for precise signal amplification and conditioning, ensuring optimal performance in industrial environments.
- Medical Devices: Integrated into medical instruments for accurate signal processing in diagnostic equipment and patient monitoring systems, enhancing healthcare outcomes.
- Automotive Electronics: Employed in automotive sensor interfaces and control units for reliable signal amplification and filtering, contributing to vehicle safety and efficiency.
- Telecommunications: Incorporated into communication infrastructure for signal conditioning and amplification, ensuring seamless data transmission and reception.
- Consumer Electronics: Integrated into audio amplifiers and signal processing circuits in consumer electronic devices such as smartphones, tablets, and audio systems, delivering high-fidelity audio performance.
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