TSV6390ICT
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- Mfr.Part #
- TSV6390ICT
- Manufacturer
- STMicroelectronics
- Package / Case
- 6-TSSOP, SC-88, SOT-363
- Datasheet
- Download
- Description
- IC OPAMP GP 1 CIRCUIT SC70-6
- Stock
- 42,828
- In Stock ：
- 42,828
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- Manufacturer :
- STMicroelectronics
- Product Category :
- Instrumentation, OP Amps, Buffer Amps
- Number of Pins :
- 6
- RoHS Status :
- ROHS3 Compliant
- Low-Offset :
- No
- Mount :
- Surface Mount
- Micropower :
- yes
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Length :
- 2.2mm
- Current - Input Bias :
- 1pA
- Number of Channels :
- 1
- Nominal Supply Current :
- 60μA
- REACH SVHC :
- No SVHC
- Power :
- No
- Pin Count :
- 6
- Package / Case :
- 6-TSSOP, SC-88, SOT-363
- Operating Temperature :
- -40°C~125°C
- Radiation Hardening :
- No
- Voltage - Supply, Single/Dual (±) :
- 1.5V~5.5V
- Lifecycle Status :
- ACTIVE (Last Updated: 7 months ago)
- Packaging :
- Tape and Reel (TR)
- Mounting Type :
- Surface Mount
- Output Type :
- Rail-to-Rail
- Bandwidth :
- 2.4MHz
- Supply Voltage :
- 1.8V
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Form :
- Gull wing
- Common Mode Rejection Ratio :
- 60 dB
- Voltage Gain :
- 98dB
- Amplifier Type :
- GENERAL PURPOSE
- Supply Voltage Limit-Max :
- 6V
- Unity Gain BW-Nom :
- 2000 kHz
- JESD-609 Code :
- e3
- ECCN Code :
- EAR99
- Number of Functions :
- 1
- Number of Terminations :
- 6
- Width :
- 1.35mm
- Slew Rate :
- 1.1V/μs
- Base Part Number :
- TSV6390
- Output Current per Channel :
- 72mA
- Output Current :
- 72mA
- Architecture :
- VOLTAGE-FEEDBACK
- Low-Bias :
- yes
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Height :
- 1mm
- Frequency Compensation :
- yes
- Factory Lead Time :
- 12 Weeks
- Input Offset Voltage (Vos) :
- 3mV
- Terminal Position :
- Dual
- Packing Method :
- Tape and Reel
- Lead Free :
- Lead Free
- Operating Supply Current :
- 60μA
- Datasheets
- TSV6390ICT
[Instrumentation, OP Amps, Buffer Amps - STMicroelectronics TSV6390ICT] Overview
Introducing the cutting-edge TSV6390ICT by STMicroelectronics, a leading name in integrated circuits technology. This IC OPAMP GP 1 CIRCUIT SC706 stands at the forefront of innovation, offering unparalleled performance and versatility in the realm of instrumentation, operational amplifiers, and buffer amplifiers.
Designed to meet the demanding requirements of modern electronic applications, this compact yet powerful device boasts a myriad of features tailored to optimize circuit performance and ensure reliable operation in diverse scenarios.
With its robust construction and advanced functionality, the TSV6390ICT redefines the standards of excellence in the field, making it the preferred choice for professionals and enthusiasts alike.
TSV6390ICT Features
- High Precision: Delivers exceptional accuracy and stability for precise measurements in instrumentation applications.
- Wide Bandwidth: Offers a broad frequency range, enabling efficient signal processing in various electronic circuits.
- Low Power Consumption: Optimized power management ensures energy efficiency, prolonging battery life in portable devices.
- Enhanced Reliability: Built to withstand harsh operating conditions, ensuring long-term performance and durability.
- Compact Design: Space-saving form factor facilitates integration into compact electronic systems without compromising functionality.
- Flexible Configuration: Versatile configuration options enable customization to suit specific application requirements.
TSV6390ICT Applications
- Industrial Automation: Utilized in process control systems and machinery for precise signal amplification and conditioning, ensuring optimal performance in industrial environments.
- Medical Devices: Integrated into medical instruments for accurate signal processing in diagnostic equipment and patient monitoring systems, enhancing healthcare outcomes.
- Automotive Electronics: Employed in automotive sensor interfaces and control units for reliable signal amplification and filtering, contributing to vehicle safety and efficiency.
- Telecommunications: Incorporated into communication infrastructure for signal conditioning and amplification, ensuring seamless data transmission and reception.
- Consumer Electronics: Integrated into audio amplifiers and signal processing circuits in consumer electronic devices such as smartphones, tablets, and audio systems, delivering high-fidelity audio performance.
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