TSV6390ICT
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- Mfr.Part #
- TSV6390ICT
- Manufacturer
- STMicroelectronics
- Package / Case
- 6-TSSOP, SC-88, SOT-363
- Datasheet
- Download
- Description
- IC OPAMP GP 1 CIRCUIT SC70-6
- Stock
- 42,828
- In Stock ：
- 42,828
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- Manufacturer :
- STMicroelectronics
- Product Category :
- Instrumentation, OP Amps, Buffer Amps
- Output Current :
- 72mA
- Lifecycle Status :
- ACTIVE (Last Updated: 7 months ago)
- Bandwidth :
- 2.4MHz
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tape and Reel (TR)
- Number of Pins :
- 6
- REACH SVHC :
- No SVHC
- Lead Free :
- Lead Free
- Frequency Compensation :
- yes
- Height :
- 1mm
- Supply Voltage :
- 1.8V
- Unity Gain BW-Nom :
- 2000 kHz
- Voltage Gain :
- 98dB
- Voltage - Supply, Single/Dual (±) :
- 1.5V~5.5V
- Architecture :
- VOLTAGE-FEEDBACK
- Low-Bias :
- yes
- Packing Method :
- Tape and Reel
- Mounting Type :
- Surface Mount
- Terminal Position :
- Dual
- Operating Temperature :
- -40°C~125°C
- Width :
- 1.35mm
- Micropower :
- yes
- Factory Lead Time :
- 12 Weeks
- Package / Case :
- 6-TSSOP, SC-88, SOT-363
- JESD-609 Code :
- e3
- Power :
- No
- Number of Terminations :
- 6
- Operating Supply Current :
- 60μA
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Input Offset Voltage (Vos) :
- 3mV
- Supply Voltage Limit-Max :
- 6V
- Peak Reflow Temperature (Cel) :
- 260
- Number of Functions :
- 1
- Output Type :
- Rail-to-Rail
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Amplifier Type :
- GENERAL PURPOSE
- Current - Input Bias :
- 1pA
- Nominal Supply Current :
- 60μA
- Slew Rate :
- 1.1V/μs
- Terminal Form :
- Gull wing
- Output Current per Channel :
- 72mA
- Length :
- 2.2mm
- Low-Offset :
- No
- Number of Channels :
- 1
- Base Part Number :
- TSV6390
- Radiation Hardening :
- No
- Pin Count :
- 6
- Common Mode Rejection Ratio :
- 60 dB
- Mount :
- Surface Mount
- Datasheets
- TSV6390ICT
[Instrumentation, OP Amps, Buffer Amps - STMicroelectronics TSV6390ICT] Overview
Introducing the cutting-edge TSV6390ICT by STMicroelectronics, a leading name in integrated circuits technology. This IC OPAMP GP 1 CIRCUIT SC706 stands at the forefront of innovation, offering unparalleled performance and versatility in the realm of instrumentation, operational amplifiers, and buffer amplifiers.
Designed to meet the demanding requirements of modern electronic applications, this compact yet powerful device boasts a myriad of features tailored to optimize circuit performance and ensure reliable operation in diverse scenarios.
With its robust construction and advanced functionality, the TSV6390ICT redefines the standards of excellence in the field, making it the preferred choice for professionals and enthusiasts alike.
TSV6390ICT Features
- High Precision: Delivers exceptional accuracy and stability for precise measurements in instrumentation applications.
- Wide Bandwidth: Offers a broad frequency range, enabling efficient signal processing in various electronic circuits.
- Low Power Consumption: Optimized power management ensures energy efficiency, prolonging battery life in portable devices.
- Enhanced Reliability: Built to withstand harsh operating conditions, ensuring long-term performance and durability.
- Compact Design: Space-saving form factor facilitates integration into compact electronic systems without compromising functionality.
- Flexible Configuration: Versatile configuration options enable customization to suit specific application requirements.
TSV6390ICT Applications
- Industrial Automation: Utilized in process control systems and machinery for precise signal amplification and conditioning, ensuring optimal performance in industrial environments.
- Medical Devices: Integrated into medical instruments for accurate signal processing in diagnostic equipment and patient monitoring systems, enhancing healthcare outcomes.
- Automotive Electronics: Employed in automotive sensor interfaces and control units for reliable signal amplification and filtering, contributing to vehicle safety and efficiency.
- Telecommunications: Incorporated into communication infrastructure for signal conditioning and amplification, ensuring seamless data transmission and reception.
- Consumer Electronics: Integrated into audio amplifiers and signal processing circuits in consumer electronic devices such as smartphones, tablets, and audio systems, delivering high-fidelity audio performance.
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