TSM-139-03-G-DV

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Number of Rows :

2

Plating Thickness :

10μin

Feature :

Board Guide

PCB Contact Row Spacing :

4.953 mm

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Termination :

Solder

Body Depth :

0.15 inch

Board Mounting Option :

PEG

Contact Material :

Phosphor Bronze

Connector Type :

Header

Gender :

Male

Insulation Material :

Liquid Crystal Polymer (LCP)

Total Number of Contacts :

78

PCB Contact Pattern :

RECTANGULAR

Mating Contact Pitch :

0.1 inch

MIL Conformance :

No

Mixed Contacts :

No

Contact Shape :

Square

Insulation Color :

Black

Pitch - Mating :

0.100 2.54mm

Radiation Hardening :

No

JESD-609 Code :

e4

Style :

Board to Board or Cable

Shrouding :

Unshrouded

Operating Temperature :

-55°C~125°C

Option :

GENERAL PURPOSE

IEC Conformance :

No

Body Length or Diameter :

3.9 inch

DIN Conformance :

No

Number of Conductors :

ONE

Mounting Type :

Surface Mount

Material Flammability Rating :

UL94 V-0

Contact Length - Mating :

0.420 10.67mm

Pbfree Code :

yes

RoHS Status :

ROHS3 Compliant

Packaging :

Tube

Filter Feature :

No

UL Flammability Code :

94V-0

Reliability :

COMMERCIAL

Contact Finish - Mating :

Gold

Factory Lead Time :

3 Weeks

HTS Code :

8536.69.40.40

Row Spacing - Mating :

0.100 (2.54mm)

Contact Finish Thickness - Post :

3.00μin 0.076μm

Fastening Type :

Push-Pull

Number Of PCB Rows :

2

Contact Type :

Male Pin

Insulation Height :

0.100 2.54mm

Series :

TSM

Number of Positions :

78

ECCN Code :

EAR99

Number of Positions Loaded :

All