TSM-113-01-T-DV-A-P
- Mfr.Part #
- TSM-113-01-T-DV-A-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 26POS 2.54MM
- Stock
- 2,652
- In Stock :
- 2,652
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Insulation Height :
- 0.100 2.54mm
- Mating Contact Pitch :
- 0.1 inch
- Number of Positions Loaded :
- All
- Insulation Color :
- Black
- Connector Type :
- Header
- Pitch - Mating :
- 0.100 2.54mm
- Option :
- GENERAL PURPOSE
- Gender :
- Male
- Number of Conductors :
- ONE
- Filter Feature :
- No
- RoHS Status :
- ROHS3 Compliant
- Additional Feature :
- E.L.P.
- MIL Conformance :
- No
- Series :
- TSM
- Operating Temperature :
- -55°C~105°C
- Contact Shape :
- Square
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Rows :
- 2
- Reliability :
- COMMERCIAL
- Number of Positions :
- 26
- Total Number of Contacts :
- 26
- Contact Finish - Mating :
- Tin
- Contact Material :
- Phosphor Bronze
- JESD-609 Code :
- e3
- Style :
- Board to Board or Cable
- Body Depth :
- 0.15 inch
- DIN Conformance :
- No
- Pbfree Code :
- yes
- Contact Type :
- Male Pin
- Number Of PCB Rows :
- 2
- PCB Contact Pattern :
- RECTANGULAR
- Shrouding :
- Unshrouded
- Factory Lead Time :
- 6 Weeks
- Body Length or Diameter :
- 1.3 inch
- Contact Length - Mating :
- 0.230 5.84mm
- IEC Conformance :
- No
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Material Flammability Rating :
- UL94 V-0
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Feature :
- Board Guide, Pick and Place
- PCB Contact Row Spacing :
- 4.953 mm
- Board Mounting Option :
- PEG
- Packaging :
- Tube
- Radiation Hardening :
- No
- Termination :
- Solder
- Mounting Type :
- Surface Mount
- Lead Free :
- Lead Free
- Fastening Type :
- Push-Pull
- Mixed Contacts :
- No
- Datasheets
- TSM-113-01-T-DV-A-P

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Tin Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.100 2.54mm Height
TSM-113-01-T-DV-A-P Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Board Guide, Pick and Place feature.There is no operating temperature for the device.
TSM-113-01-T-DV-A-P Features
TSM series
TSM-113-01-T-DV-A-P Applications
There are a lot of Samtec Inc.
TSM-113-01-T-DV-A-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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