TSE2002B3CNCG
- Mfr.Part #
- TSE2002B3CNCG
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- Datasheet
- Download
- Description
- IC TEMP SENS EEPROM TDFN-8
- Stock
- 40,275
- In Stock :
- 40,275
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Thermal Management
- Number of Terminations :
- 8
- Terminal Finish :
- Matte Tin (Sn)
- Length :
- 2mm
- Pbfree Code :
- yes
- Pin Count :
- 8
- Packaging :
- Bulk
- Number of Pins :
- 8
- Width :
- 3mm
- Min Operating Temperature :
- -20°C
- RoHS Status :
- RoHS Compliant
- Thickness :
- 750μm
- Power Supplies :
- 3.3V
- Output Type :
- Digital, I2C
- Mount :
- Surface Mount
- Published :
- 2004
- Operating Supply Voltage :
- 3.6V
- Max Operating Temperature :
- 125°C
- JESD-609 Code :
- e3
- Lead Free :
- Lead Free
- Radiation Hardening :
- No
- Interface :
- 2-Wire, I2C, Serial
- Datasheets
- TSE2002B3CNCG

Thermal Management Intersil (Renesas Electronics Corporation) TSE2002B3CNCG Overview
The Intersil TSE2002B3CNCG is a sophisticated temperature sensor with integrated EEPROM, designed specifically for advanced thermal management solutions. As a high-performance IC, it offers precise temperature monitoring and data storage capabilities, crucial for maintaining system stability and performance in various electronics. Manufactured by Renesas Electronics Corporation, this device incorporates cutting-edge technology that ensures reliable and accurate temperature readings with minimal power consumption. Ideal for applications requiring meticulous temperature control and calibration, the TSE2002B3CNCG stands out for its integration of robust sensor mechanisms and memory components, providing a compact, efficient solution in a TDFN8 package.
TSE2002B3CNCG Features
This temperature sensor IC is notable for its high accuracy and integrated EEPROM feature which allows it to store crucial calibration data and configurations. The device operates over a wide temperature range, offering stability and reliability in extreme conditions. Its low power consumption makes it ideal for energy-sensitive applications. Additionally, its small form factor (TDFN8 package) facilitates easy integration into existing designs without requiring substantial redesigns.
TSE2002B3CNCG Applications
- Computing Systems: Enhances performance and reliability by monitoring and controlling CPU and GPU temperatures, preventing thermal runaways.
- Telecommunication Equipment: Maintains optimal operating temperatures in routers and switches, ensuring high reliability and longevity under variable environmental conditions.
- Industrial Systems: Used in thermal management of automated equipment to prevent overheating and ensure consistent performance across various temperatures.
- Consumer Electronics: Provides temperature control solutions in devices like smart thermostats and HVAC systems, enhancing user comfort and device efficiency.
- Automotive Electronics: Crucial for monitoring critical components in vehicles to ensure safety and efficient operation under varying thermal conditions.
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