TLV2231CDBVR
- Mfr.Part #
- TLV2231CDBVR
- Manufacturer
- Texas Instruments
- Package / Case
- SC-74A, SOT-753
- Datasheet
- Download
- Description
- IC OPAMP GP 1 CIRCUIT SOT23-5
- Stock
- 15,207
- In Stock :
- 15,207
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- Manufacturer :
- Texas Instruments
- Product Category :
- Instrumentation, OP Amps, Buffer Amps
- Output Current :
- 50mA
- Lifecycle Status :
- ACTIVE (Last Updated: 2 days ago)
- Voltage Gain :
- 112.04dB
- Number of Channels :
- 1
- Low-Offset :
- No
- Micropower :
- yes
- Operating Supply Voltage :
- 5V
- Power Dissipation :
- 150mW
- Voltage - Supply, Single/Dual (±) :
- 2.7V~10V ±1.35V~5V
- Gain Bandwidth Product :
- 2MHz
- Bandwidth :
- 1.9MHz
- Number of Terminations :
- 5
- Pbfree Code :
- yes
- Programmable Power :
- No
- Input Offset Voltage (Vos) :
- 3mV
- Operating Temperature :
- 0°C~70°C
- Length :
- 2.9mm
- REACH SVHC :
- No SVHC
- Output Current per Channel :
- 50mA
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- JESD-609 Code :
- e4
- Number of Functions :
- 1
- Input Offset Current-Max (IIO) :
- 0.00006μA
- Amplifier Type :
- GENERAL PURPOSE
- Thickness :
- 1.2mm
- Height :
- 1.45mm
- Pin Count :
- 5
- Number of Pins :
- 5
- Bias Current-Max (IIB) @25C :
- 0.00006μA
- Average Bias Current-Max (IIB) :
- 0.00006μA
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Current :
- 850μA
- Nominal Supply Current :
- 1.3mA
- Radiation Hardening :
- No
- Supply Voltage :
- 3V
- Series :
- LinCMOS™
- Slew Rate :
- 1.6V/µs
- Architecture :
- VOLTAGE-FEEDBACK
- Dual Supply Voltage :
- 3V
- Voltage - Input Offset :
- 710μV
- Output Type :
- Rail-to-Rail
- Common Mode Rejection Ratio :
- 60 dB
- Current - Input Bias :
- 1pA
- Contact Plating :
- Gold
- Width :
- 1.6mm
- RoHS Status :
- ROHS3 Compliant
- Unity Gain BW-Nom :
- 2000 kHz
- Terminal Position :
- Dual
- Surface Mount :
- yes
- Max I/O Voltage :
- 3mV
- Lead Free :
- Lead Free
- Package / Case :
- SC-74A, SOT-753
- Max Power Dissipation :
- 150mW
- Base Part Number :
- TLV2231
- Packing Method :
- TR
- Packaging :
- Tape and Reel (TR)
- Low-Bias :
- yes
- Frequency Compensation :
- yes
- Terminal Form :
- Gull wing
- Factory Lead Time :
- 12 Weeks
- Datasheets
- TLV2231CDBVR

[Instrumentation OP Amps Buffer Amps Texas Instruments TLV2231CDBVR] Overview
Introducing the TLV2231CDBVR, a high-performance integrated circuit designed by Texas Instruments to meet the demanding needs of modern electronic applications. As a leading manufacturer in the industry, Texas Instruments has engineered this op-amp with precision and reliability, catering to the diverse requirements of instrumentation, operational amplifier, and buffer amplifier circuits.
With its compact SOT235 package, the TLV2231CDBVR offers unparalleled versatility, making it suitable for a wide range of industrial and commercial applications. Whether you're designing sophisticated measurement instruments or refining signal processing systems, this op-amp delivers exceptional performance and consistency, ensuring optimal results in every use case.
Trust in Texas Instruments to provide cutting-edge solutions for your circuit design needs. Experience the difference with the TLV2231CDBVR and elevate your projects to new heights of excellence.
TLV2231CDBVR Features
- High-performance integrated circuit from Texas Instruments
- Designed for instrumentation, operational amplifier, and buffer amplifier circuits
- Compact SOT235 package for versatile application
- Exceptional precision and reliability
- Ideal for industrial and commercial applications
- Ensures optimal performance and consistency
- Engineered for modern electronic systems
TLV2231CDBVR Applications
- Industrial Automation: Utilized in control systems and data acquisition devices for precise signal processing and monitoring.
- Medical Devices: Integrated into medical equipment such as patient monitoring systems and diagnostic instruments for accurate data measurement and analysis.
- Audio Amplification: Incorporated in audio equipment such as amplifiers and mixers to enhance signal quality and fidelity, delivering superior sound output.
- Sensor Interfaces: Integrated into sensor interface circuits to amplify and condition sensor signals for reliable and accurate measurement in various sensing applications.
- Communications Systems: Employed in communication devices and network infrastructure for efficient signal amplification and processing, ensuring reliable data transmission.
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