TE28F256P33BFA
- Mfr.Part #
- TE28F256P33BFA
- Manufacturer
- Micron Technology
- Package / Case
- 56-TFSOP (0.724, 18.40mm Width)
- Datasheet
- Download
- Description
- IC FLASH 256MBIT PARALLEL 56TSOP
- Stock
- 23,125
- In Stock :
- 23,125
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Organization :
- 16MX16
- Density :
- 256 Mb
- HTS Code :
- 8542.32.00.51
- Supply Voltage-Max (Vsup) :
- 3.6V
- Number of Pins :
- 56
- Terminal Pitch :
- 0.5mm
- Memory Format :
- Flash
- JESD-609 Code :
- e0
- Sync/Async :
- ASYNCHRONOUS
- ECCN Code :
- 3A991.B.1.A
- Memory Size :
- 256Mb 16M x 16
- Memory Width :
- 16
- Number of Functions :
- 1
- Base Part Number :
- 28F256P33
- Terminal Finish :
- TIN LEAD
- Terminal Position :
- Dual
- Height Seated (Max) :
- 1.2mm
- Address Bus Width :
- 24b
- Word Size :
- 16b
- Pin Count :
- 56
- Published :
- 2008
- Series :
- Axcell™
- Operating Temperature :
- -40°C~85°C TC
- Mounting Type :
- Surface Mount
- Supply Voltage-Min (Vsup) :
- 2.3V
- Clock Frequency :
- 40MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Mount :
- Surface Mount
- Nominal Supply Current :
- 31mA
- Length :
- 18.4mm
- Qualification Status :
- Not Qualified
- Reach Compliance Code :
- Unknown
- Moisture Sensitivity Level (MSL) :
- 2 (1 Year)
- Memory Interface :
- Parallel
- Memory Type :
- Non-Volatile
- Voltage - Supply :
- 2.3V~3.6V
- Package / Case :
- 56-TFSOP (0.724, 18.40mm Width)
- Boot Block :
- BOTTOM
- Number of Terminations :
- 56
- Peak Reflow Temperature (Cel) :
- 235
- Access Time (Max) :
- 105 ns
- Programming Voltage :
- 2.7V
- Interface :
- Parallel, Serial
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 3V
- Write Cycle Time - Word, Page :
- 105ns
- Datasheets
- TE28F256P33BFA

Memory Micron Technology TE28F256P33BFA Overview
The Memory Micron Technology TE28F256P33BFA is a high-performance 256Mbit flash memory IC, designed for optimal reliability and efficiency in a wide range of industrial and commercial applications. Manufactured by Micron Technology, a leader in memory and storage solutions, this IC features a parallel interface in a compact 56TSOP package, ensuring robust data management and storage capabilities. Its advanced technology is tailored for systems requiring large-volume, non-volatile memory. With its excellent durability and speed, it stands out as an essential component for manufacturers seeking to innovate and enhance their product offerings.
TE28F256P33BFA Features
This flash memory IC excels in performance and reliability, featuring a 256Mbit capacity with a parallel interface, enabling quick data access and high throughput. The 56TSOP package is designed for space-efficient mounting, making it ideal for applications with limited PCB space. Furthermore, its endurance and stability under extended operational temperatures make it suitable for harsh environmental conditions.
TE28F256P33BFA Applications
- Automotive Systems: Used in engine control units, infotainment systems, and advanced driver-assistance systems (ADAS), where robust data storage that can withstand extreme conditions is crucial.
- Telecommunication Equipment: Employs this IC for storing firmware and other critical data in devices such as routers, switches, and base stations that require high reliability and quick access to large volumes of data.
- Industrial Automation: Integrates into control systems, sensors, and actuators, facilitating efficient process control and monitoring in manufacturing environments.
- Consumer Electronics: Utilized in devices like set-top boxes and smart TVs, providing dependable storage for operating systems and application software.
- Medical Devices: Supports functionality in medical monitoring systems and diagnostic equipment, where precision and data integrity are paramount.
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