TE28F160B3TD70A

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Mfr.Part #
TE28F160B3TD70A
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 16MBIT PARALLEL 48TSOP
Stock
45,739
In Stock :
45,739

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Manufacturer :
Micron Technology
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Max Operating Temperature :
85°C
Packaging :
Tray
Published :
2002
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Operating Temperature :
-40°C~85°C TA
Voltage - Supply :
2.7V~3.6V
Interface :
Parallel
Min Operating Temperature :
-40°C
Memory Format :
Flash
Write Cycle Time - Word, Page :
70ns
Memory Size :
16Mb 1M x 16
RoHS Status :
Non-RoHS Compliant
Memory Interface :
Parallel
Supplier Device Package :
48-TSOP
Mounting Type :
Surface Mount
Base Part Number :
28F160B3
Memory Type :
Non-Volatile
Access Time :
70ns
Datasheets
TE28F160B3TD70A
Introducing Memory Micron Technology TE28F160B3TD70A from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:48-TFSOP (0.724, 18.40mm Width), Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Base Part Number:28F160B3, TE28F160B3TD70A pinout, TE28F160B3TD70A datasheet PDF, TE28F160B3TD70A amp .Beyond Memory Micron Technology TE28F160B3TD70A ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology TE28F160B3TD70A


Memory Micron Technology TE28F160B3TD70A Overview

The Memory Micron Technology TE28F160B3TD70A is a high-performance IC FLASH memory chip that offers a substantial 16 Mbit storage capacity. This chip, housed in a compact 48TSOP package, is designed for high-speed, reliable parallel interfaces, making it an excellent choice for applications requiring fast and robust data storage and retrieval. Its robust design and advanced manufacturing technology ensure optimal reliability and functionality for demanding applications, positioning it as a key component for developers and manufacturers looking to enhance their systems with efficient, high-capacity memory solutions.

TE28F160B3TD70A Features

This memory chip integrates several features that make it particularly suited for a wide range of industrial and commercial applications. These include low power consumption, high data transfer speed, and a wide operating temperature range. Its durability and easy integration also make it a versatile choice for designers and engineers looking to leverage robust memory storage in their designs.

TE28F160B3TD70A Applications

  • Embedded Systems: Used to store firmware or application software in various embedded devices, enhancing the performance and reliability of system operations.
  • Consumer Electronics: Integral in devices such as set-top boxes, gaming consoles, and digital cameras, where large, fast memory is crucial for user interface and functionality enhancements.
  • Telecommunications: Serves in telecommunications equipment, supporting the storage of operational data and software which are vital for network management and reliability.
  • Automotive Electronics: Utilized in automotive control systems where durable and reliable memory is necessary to perform under varying environmental conditions and ensure safety and efficiency.
  • Industrial Automation: Facilitates improved process control by storing critical program data and operating parameters essential for automation equipment.
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Shipping Cost

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