TDA3MVRBFABFRQ1

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Mfr.Part #
TDA3MVRBFABFRQ1
Manufacturer
Texas Instruments
Package / Case
FCBGA-367
Datasheet
Download
Description
IC SOC PROCESSOR
Stock
15,232
In Stock :
15,232

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Manufacturer :
Texas Instruments
Product Category :
System On Chip (SoC)
Product Status :
Active
Data Bus Width :
32 bit
Primary Attributes :
-
Number of I/Os :
126 I/O
RAM Size :
512kB
Mounting Style :
SMD/SMT
Architecture :
DSP, MPU
Number of I/O :
126
Maximum Operating Temperature :
+ 125 C
Core Processor :
ARM® Cortex®-M4, C66x
Supplier Device Package :
367-FCBGA (15x15)
Speed :
212.8MHz, 745MHz
Peripherals :
DMA, PWM, WDT
Number of Cores :
2 Core
Product :
DSPs
Series :
TDA3MV
Operating Temperature :
-40°C ~ 125°C (TJ)
Packaging :
Reel
RoHS :
Details
Minimum Operating Temperature :
- 40 C
Package :
Tape and Reel (TR)
Interface Type :
I2C, SPI
Package / Case :
FCBGA-367
Connectivity :
CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
Flash Size :
-
Number of Timers/Counters :
8
Datasheets
TDA3MVRBFABFRQ1
Introducing System On Chip (SoC) Texas Instruments TDA3MVRBFABFRQ1 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 125°C (TJ), Package / Case:FCBGA-367, TDA3MVRBFABFRQ1 pinout, TDA3MVRBFABFRQ1 datasheet PDF, TDA3MVRBFABFRQ1 amp .Beyond System On Chip (SoC) Texas Instruments TDA3MVRBFABFRQ1 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TDA3MVRBFABFRQ1


CPLD TDA3MV Series FCBGA-367

TDA3MVRBFABFRQ1 Overview


In the FCBGA-367 package, it is a type of electronic component.It has a packaging style of Reel.It is recommended that the device operate at a temperature of -40°C ~ 125°C (TJ) to ensure its normal operation.It is a part of the TDA3MV series of digital signal processors.Count, measure, and measure external events using 8 timers/counters.126 I/Os are present on the device.It has 2 Core cores.

TDA3MVRBFABFRQ1 Features


Supplied in the FCBGA-367 package
8 timers/counters
126 I/Os
2 Core cores


TDA3MVRBFABFRQ1 Applications


There are a lot of Texas Instruments
TDA3MVRBFABFRQ1 DSP applications.


  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
  • Image compression
  • Signal processing for telecommunications
  • Control systems
  • Biomedical engineering
  • MP3 audio player
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