T35F324C3

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Mfr.Part #
T35F324C3
Manufacturer
Efinix, Inc.
Package / Case
324-VFBGA
Datasheet
Download
Description
IC FPGA TRION T35 130 IO 324FBGA
Stock
11,424
In Stock :
11,424

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Manufacturer :
Efinix, Inc.
Product Category :
FPGAs (Field Programmable Gate Array)
Supplier Device Package :
324-FBGA (12x12)
Operating Temperature :
0°C ~ 85°C (TJ)
Number of Logic Elements/Cells :
31680
Total RAM Bits :
1510400
Voltage - Supply :
1.15V ~ 1.25V
Product Status :
Active
Package / Case :
324-VFBGA
Number of I/O :
130
Mounting Type :
Surface Mount
Datasheets
T35F324C3
Introducing FPGAs (Field Programmable Gate Array) Efinix, Inc. T35F324C3 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 85°C (TJ), Package / Case:324-VFBGA, Mounting Type:Surface Mount, T35F324C3 pinout, T35F324C3 datasheet PDF, T35F324C3 amp .Beyond FPGAs (Field Programmable Gate Array) Efinix, Inc. T35F324C3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Efinix, Inc. T35F324C3


FPGAs Efinix, Inc. T35F324C3 Overview

Introducing the Efinix, Inc. T35F324C3, a high-performance FPGA from the renowned Trion T35 series, designed to meet the evolving needs of modern embedded systems. This IC FPGA features a robust architecture packaged in a compact 324FBGA format, making it an ideal solution for applications requiring high-speed logic operations and flexibility. With 130 I/O points, it provides ample connectivity for a wide range of devices, supporting complex, multi-functional system designs. The T35F324C3 is engineered to offer superior configurability and efficiency, crucial for developers looking to accelerate time-to-market while maintaining scalability and power management.

T35F324C3 Features

The T35F324C3 FPGA by Efinix, Inc. stands out with its compact size and powerful capabilities. It offers a balance of performance and power efficiency, ideal for space-constrained applications that require intensive data processing. Key features include an advanced 130 IO interface for enhanced peripheral connectivity, a high-density 324-pin ball grid array (BGA) package for robust physical integration, and support for a variety of logic configurations to adapt to different application needs.

T35F324C3 Applications

  • Consumer Electronics: Utilized in smart home devices and personal electronics where flexible I/O configurations are necessary to handle various sensors and connectivity options.
  • Industrial Automation: Applied in control systems and automation technology to perform complex logical operations, enhancing process efficiency and reliability.
  • Automotive Systems: Integral in driver assistance systems and in-vehicle infotainment (IVI), where robust performance and high reliability are crucial.
  • Telecommunications: Supports infrastructure for data processing in communication networks, improving bandwidth and signal integrity.
  • Medical Devices: Used in diagnostic equipment and wearable health monitors, ensuring accurate data collection and real-time processing.
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