SPAKXC309VF100A

Manufacturer :

NXP Semiconductors

Product Category :

DSP (Digital Signal Processors)

HTS Code :

8542.31.00.01

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

30

Voltage - I/O :

3.30V

Clock Frequency :

100MHz

Length :

15mm

Surface Mount :

yes

Qualification Status :

Not Qualified

Supply Voltage-Max (Vsup) :

3.6V

Number of Terminations :

196

Peak Reflow Temperature (Cel) :

220

Packaging :

Tray

Base Part Number :

SPAKXC309

Internal Bus Architecture :

Multiple

Low Power Mode :

yes

Interface :

Host Interface, SSI, SCI

Width :

15mm

On Chip Data RAM :

24KB

Boundary Scan :

yes

Barrel Shifter :

yes

Supply Voltage :

3.3V

External Data Bus Width :

24

Terminal Pitch :

1mm

Type :

FIXED POINT

Terminal Form :

Ball

Package / Case :

196-LBGA

Series :

DSP563xx

ECCN Code :

3A001.A.3

Non-Volatile Memory :

ROM (576B)

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~105°C TJ

Published :

2005

Supply Voltage-Min (Vsup) :

3V

Clock Rate :

100MHz

Height Seated (Max) :

1.6mm

Address Bus Width :

18

RoHS Status :

Non-RoHS Compliant

Terminal Position :

BOTTOM

JESD-30 Code :

S-PBGA-B196