SN74ALVC7803-40DLR

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Mfr.Part #
SN74ALVC7803-40DLR
Manufacturer
Texas Instruments
Package / Case
56-BSSOP (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MEMORY FIFO 512X18 56-SSOP
Stock
18,552
In Stock :
18,552

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Manufacturer :
Texas Instruments
Product Category :
FIFOs Memory
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Length :
18.415mm
Parallel/Serial :
Parallel
Current - Supply (Max) :
40μA
Programmable Flags Support :
yes
Supply Voltage-Min (Vsup) :
3.3V
Retransmit Capability :
No
Base Part Number :
74ALVC7803
Access Time :
20ns
Bus Directional :
Uni-Directional
Memory Size :
9K 512 x 18
Power Supplies :
3.3V
Memory IC Type :
OTHER FIFO
Memory Density :
9216 bit
Cycle Time :
40 ns
Package / Case :
56-BSSOP (0.295, 7.50mm Width)
Clock Frequency :
25MHz
Voltage - Supply :
3V~3.6V
Data Rate :
25MHz
Number of Terminations :
56
Number of Pins :
56
Series :
74ALVC
HTS Code :
8542.32.00.71
Operating Temperature :
0°C~70°C
Output Characteristics :
3-STATE
Output Enable :
yes
Expansion Type :
Width
Terminal Form :
Gull wing
ECCN Code :
EAR99
Terminal Pitch :
0.635mm
Height Seated (Max) :
2.79mm
Mount :
Surface Mount
Terminal Position :
Dual
Packaging :
Tape and Reel (TR)
Function :
SYNCHRONOUS
Supply Voltage :
3.3V
Mounting Type :
Surface Mount
Organization :
512X18
Memory Width :
18
Width :
7.5mm
Supply Voltage-Max (Vsup) :
3.6V
RoHS Status :
ROHS3 Compliant
Introducing FIFOs Memory Texas Instruments SN74ALVC7803-40DLR from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:74ALVC7803, Package / Case:56-BSSOP (0.295, 7.50mm Width), Number of Terminations:56, Number of Pins:56, Operating Temperature:0°C~70°C, Mounting Type:Surface Mount, SN74ALVC7803-40DLR pinout, SN74ALVC7803-40DLR datasheet PDF, SN74ALVC7803-40DLR amp .Beyond FIFOs Memory Texas Instruments SN74ALVC7803-40DLR ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments SN74ALVC7803-40DLR


FIFOs Memory Texas Instruments SN74ALVC7803-40DLR Overview

The FIFOs Memory Texas Instruments SN74ALVC7803-40DLR is a high-performance Integrated Circuit specifically designed to meet the demanding requirements of data buffering applications. This memory component, featuring a 512 x 18 bit configuration, is housed in a compact 56SSOP package, making it ideal for systems where space is at a premium. The SN74ALVC7803-40DLR is crafted to facilitate smooth and reliable data flow between mismatched speed processors or varying bus loads, ensuring minimal data delay and high throughput in critical applications. Its robust design and advanced technology render it perfect for a wide range of commercial and industrial applications, particularly where rapid data access and buffer reliability are essential.

SN74ALVC7803-40DLR Features

The SN74ALVC7803-40DLR offers several distinctive features that enhance its utility in sophisticated electronic systems:

  • 512 x 18 memory array enables substantial data storage and quick access.
  • Low operational voltage and power dissipation ensure energy efficiency.
  • Fast read and write cycle times facilitate high-speed data processing.
  • Compatible with a wide range of operating temperatures, making it suitable for use in diverse environmental conditions.

SN74ALVC7803-40DLR Applications

  • Data Streaming Devices: Utilized in multimedia streaming devices to manage data integrity and ensure seamless audio and video playback.
  • Communications Equipment: Employed in communication infrastructures to buffer data packets, optimizing the flow and reducing latency in networks.
  • Server and Storage Systems: Acts as a critical component in servers and high-performance storage systems, aiding in data sorting and temporary storage during peak loads.
  • Industrial Control Systems: Integrated into industrial controls to handle rapid data exchanges, improving system responsiveness and reliability.
  • Medical Imaging Equipment: Used in medical imaging technologies to enhance data transfer rates between different system components, crucial for real-time imaging processes.
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