SM671PEC-AFST
- Mfr.Part #
- SM671PEC-AFST
- Manufacturer
- Silicon Motion
- Package / Case
- 153-TFBGA
- Datasheet
- Download
- Description
- FERRI-UFS 3D I 64GB TLC 153BGA
- Stock
- 16,689
- In Stock :
- 16,689
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- Manufacturer :
- Silicon Motion
- Product Category :
- Memory
- Packaging :
- Bulk
- Data Format :
- V.92
- Memory Type :
- Non-Volatile
- Write Cycle Time - Word, Page :
- -
- Memory Interface :
- UFS2.1
- Series :
- MultiModem® IND
- Package :
- Tray
- Interface :
- --
- Operating Temperature :
- -40°C ~ 85°C
- Technology :
- FLASH - NAND (TLC)
- Supplier Device Package :
- 153-BGA (11.5x13)
- Memory Size :
- 512Gbit
- Voltage - Supply :
- 6 V ~ 48 V
- Base Product Number :
- SM671
- Package / Case :
- 153-TFBGA
- Data Rate :
- 33.6K
- Region Utilized :
- International
- Product Status :
- Active
- Moisture Sensitivity Level (MSL) :
- --
- Memory Format :
- Flash
- Memory Organization :
- 64G x 8
- Mounting Type :
- Desktop
- Datasheets
- SM671PEC-AFST
MultiModem® IND Memory IC MultiModem® IND Series
SM671PEC-AFST Overview
Non-Volatile is the type of memory it has. There is a Bulk case available. The 153-TFBGA case contains it. The chip has an 512Gbit memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 6 V ~ 48 V can be supplied to memory ics. Its recommended mounting type is Desktop. In its target applications, this memory ics plays an important role as a member of the MultiModem® IND series of memory devices.
SM671PEC-AFST Features
Package / Case: 153-TFBGA
SM671PEC-AFST Applications
There are a lot of Silicon Motion
SM671PEC-AFST Memory applications.
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
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