SE97TL,147

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Mfr.Part #
SE97TL,147
Manufacturer
NXP Semiconductors
Package / Case
8-XFDFN Exposed Pad
Datasheet
Download
Description
IC TEMP SENSOR DDR 3.3V 8-HXSON
Stock
39,378
In Stock :
39,378

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Manufacturer :
NXP Semiconductors
Product Category :
Thermal Management
Function :
Temp Monitoring System (Sensor), DIMM DDR Memory
Packaging :
Tape and Reel (TR)
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-40°C~125°C
Output Alarm :
yes
Reach Compliance Code :
Unknown
Output Type :
I2C/SMBus
Mounting Type :
Surface Mount
Base Part Number :
SE97
Package / Case :
8-XFDFN Exposed Pad
Voltage - Supply :
3V~3.6V
Published :
2009
Topology :
ADC (Sigma Delta), Comparator, Register Bank
Accuracy :
±3°C(Max)
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Sensing Temperature :
-40°C~125°C
Sensor Type :
Internal
Datasheets
SE97TL,147
Introducing Thermal Management NXP Semiconductors SE97TL,147 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~125°C, Mounting Type:Surface Mount, Base Part Number:SE97, Package / Case:8-XFDFN Exposed Pad, SE97TL,147 pinout, SE97TL,147 datasheet PDF, SE97TL,147 amp .Beyond Thermal Management NXP Semiconductors SE97TL,147 ,we also offer LTC2991IMS#PBF, DS1629S+, SE97BTP,547, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors SE97TL,147


Thermal Management NXP Semiconductors SE97TL,147 Overview

The SE97TL,147, manufactured by NXP Semiconductors, is a state-of-the-art IC temperature sensor specifically designed for thermal management in computing and memory systems. This sensor is adept at providing high accuracy temperature readings, crucial for maintaining optimal operational temperatures in sensitive electronic components. Operating at 3.3V, the 8HXSON package is engineered for efficient integration into dense circuit layouts, supporting streamlined design and reliability in high-performance applications. The integration of this sensor in DDR memory modules exemplifies NXP’s commitment to enhancing system stability and performance through advanced thermal management solutions.

SE97TL,147 Features

  • High accuracy temperature monitoring
  • Low-voltage operation at 3.3V
  • Compact 8HXSON package for minimal footprint
  • Optimized for DDR memory modules
  • Robust design suitable for high-performance environments

SE97TL,147 Applications

  • DDR Memory Modules: Ensures optimal functioning by maintaining critical temperature levels, preventing overheating and system failures.
  • Computing Systems: Integrates into motherboards or CPU assemblies to monitor and manage processor temperatures, enhancing overall efficiency and stability.
  • Data Centers: Used in server racks to oversee ambient and specific device temperatures, crucial for maintaining long-term reliability and performance.
  • Portable Electronics: Applies in laptops and tablets where space is limited, providing precise temperature control without compromising the device's compact design.
  • Telecommunications Equipment: Monitors temperature in communication devices to prevent thermal-induced signal degradation or hardware damage.
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