PIC32MX550F256H-50I/MR

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Mfr.Part #
PIC32MX550F256H-50I/MR
Manufacturer
Microchip Technology
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 64QFN
Stock
2,385
In Stock :
2,385

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
RoHS Status :
ROHS3 Compliant
Data Bus Width :
32b
Height Seated (Max) :
1mm
Product Status :
Active
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Terminal Position :
QUAD
Connectivity :
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Package / Case :
64-VFQFN Exposed Pad
Data Converters :
A/D 28x10b
Memory Size :
256KB
Factory Lead Time :
6 Weeks
PWM Channels :
yes
Base Part Number :
PIC32MX550F256H
Voltage - Supply (Vcc/Vdd) :
2.3V~3.6V
Package :
Tube
Bit Size :
32
Terminal Finish :
Matte Tin (Sn) - annealed
Supply Voltage-Min (Vsup) :
2.3V
Supplier Device Package :
64-QFN (9x9)
Address Bus Width :
16
Length :
9mm
Supply Voltage-Max (Vsup) :
3.6V
Interfaces :
CAN/I2C/I2S/SPI/UART
Mounting Type :
Surface Mount
Core Processor :
MIPS32® M4K™
DAC Channels :
No
Number of I/O :
49
DMA Channels :
yes
Frequency :
50MHz
Number of Terminations :
64
Data Converter :
A/D 28x10b
On Chip Program ROM Width :
8
Core Size :
32-Bit
JESD-609 Code :
e3
Operating Temperature :
-40°C~85°C TA
RAM Size :
32K x 8
Oscillator Type :
Internal
Interface :
CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
Base Product Number :
PIC32MX550
Time@Peak Reflow Temperature-Max (s) :
40
Published :
2016
Number of Timers/Counters :
5
Supply Voltage :
3.3V
Radiation Hardening :
No
Packaging :
Tube
Program Memory Type :
Flash
Program Memory Size :
256KB 256K x 8
Peak Reflow Temperature (Cel) :
260
ROM (words) :
262144
Has ADC :
yes
EEPROM Size :
-
Surface Mount :
yes
Watchdog Timer :
yes
Number of Pins :
64
Core Architecture :
PIC
Series :
PIC® 32MX
Speed :
50MHz
Introducing Microcontrollers Microchip Technology PIC32MX550F256H-50I/MR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:64-VFQFN Exposed Pad, Base Part Number:PIC32MX550F256H, Mounting Type:Surface Mount, Number of Terminations:64, Operating Temperature:-40°C~85°C TA, Number of Pins:64, PIC32MX550F256H-50I/MR pinout, PIC32MX550F256H-50I/MR datasheet PDF, PIC32MX550F256H-50I/MR amp .Beyond Microcontrollers Microchip Technology PIC32MX550F256H-50I/MR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC32MX550F256H-50I/MR


Microcontrollers Microchip Technology PIC32MX550F256H-50I/MR Overview

The Microcontrollers Microchip Technology PIC32MX550F256H-50I/MR is a high-performance, feature-rich microcontroller unit (MCU) designed to meet the rigorous demands of modern embedded systems. Manufactured by Microchip Technology, this MCU is built on a powerful 32-bit architecture and offers a substantial 256KB of flash memory. Its compact 64QFN package makes it ideal for space-constrained applications while providing ample computational power and flexibility. This product is perfect for developers looking for a scalable solution that combines efficiency with advanced capabilities in handling complex algorithms and multiple tasks simultaneously.

PIC32MX550F256H-50I/MR Features

The PIC32MX550F256H-50I/MR MCU boasts an array of features designed to support robust, multi-faceted applications. Key features include a 32-bit MIPS microAptiv™ core, a high operating frequency up to 50 MHz, and 256 KB of flash memory. Additional attributes encompass a variety of communication interfaces such as SPI, I2C, and UART, which provide excellent connectivity options. Enhanced security features and low-power consumption modes make this MCU an ideal choice for developing energy-efficient and secure applications.

PIC32MX550F256H-50I/MR Applications

  • Industrial Automation: The MCU can be integrated into automation controllers, offering precise control and connectivity to improve system efficiency and reliability.
  • Smart Home Devices: Utilizes its connectivity features to enhance user interfaces and connectivity for smart thermostats, security systems, and lighting controls.
  • Automotive Applications: Suitable for automotive subsystems like advanced driver-assistance systems (ADAS), where reliability and performance are critical.
  • Consumer Electronics: Powers complex consumer electronics, such as portable gaming devices and multimedia systems, with its robust processing capabilities and extensive memory.
  • Internet of Things (IoT): Ideal for IoT devices, leveraging its low power consumption and multiple communication interfaces to provide continuous, reliable service.
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