PI3EQX7741STZDE

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Mfr.Part #
PI3EQX7741STZDE
Manufacturer
Diodes Incorporated
Package / Case
20-WFQFN Exposed Pad
Datasheet
Download
Description
IC REDRIVER USB 3.0 2CH 20TQFN
Stock
37,203
In Stock :
37,203

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Manufacturer :
Diodes Incorporated
Product Category :
Signal Buffers, Repeaters, Splitters
Type :
Buffer, ReDriver
Mounting Type :
Surface Mount
Series :
ReDriver™
Package / Case :
20-WFQFN Exposed Pad
Applications :
USB 3.0
Base Part Number :
PI3EQX7741
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Signal Conditioning :
Input Equalization, Output De-Emphasis
Number of Channels :
2
Voltage - Supply :
3V~3.6V
Published :
2011
Packaging :
Tray
Input :
CML
Data Rate (Max) :
5Gbps
Datasheets
PI3EQX7741STZDE
Introducing Signal Buffers, Repeaters, Splitters Diodes Incorporated PI3EQX7741STZDE from Chip IC,where excellence meets affordability. This product stands out with its Type:Buffer, ReDriver, Mounting Type:Surface Mount, Package / Case:20-WFQFN Exposed Pad, Base Part Number:PI3EQX7741, Number of Channels:2, PI3EQX7741STZDE pinout, PI3EQX7741STZDE datasheet PDF, PI3EQX7741STZDE amp .Beyond Signal Buffers, Repeaters, Splitters Diodes Incorporated PI3EQX7741STZDE ,we also offer TUSB216IRWBR, DS25BR100TSD/NOPB, SN65LVDS100DGKR, Our vast inventory has you covered. Contact us now for immediate solutions.

Diodes Incorporated PI3EQX7741STZDE


Signal Buffers, Repeaters, Splitters Diodes Incorporated PI3EQX7741STZDE Overview

The PI3EQX7741STZDE from Diodes Incorporated stands as a highly efficient solution tailored for contemporary USB 3.0 applications that require signal integrity enhancement. This integrated circuit (IC) re-driver is designed to optimize signal quality by reducing inter-symbol interference and enhancing overall signal strength across longer distances. Engineered in a compact 20TQFN package, it makes an ideal choice for space-constrained environments while delivering superior performance. Its application in high-speed data environments underscores its ability to support robust and reliable data transmission, making it a crucial component for system designers seeking to improve throughput and operational efficiency in their digital communication setups.

PI3EQX7741STZDE Features

This IC is built to handle up to two channels of USB 3.0 signals, ensuring double the efficiency in data transmission paths. The PI3EQX7741STZDE enhances the quality of the signals, thus facilitating improved data integrity and reduced data errors in transmission. The compact 20TQFN packaging not only saves space but also supports easier integration into existing designs, contributing to reduced development time and faster time-to-market for USB 3.0 enabled devices.

PI3EQX7741STZDE Applications

  • High-speed Data Storage Devices: Used in SSDs and high-performance HDDs to maintain signal integrity in fast data transfer scenarios.
  • Video Streaming Equipment: Ensures robust data transmission capabilities required for handling high-definition video streams without degradation.
  • Networking and Communication Equipment: Applied in routers, switches, and network hubs to enhance signal strength and quality, ensuring reliable data transfers across network infrastructures.
  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and gaming consoles where maintaining high-speed data throughput is critical for performance and user experience.
This HTML content outlines the product's overview, key features, and specific applications, making it useful for B2B customers considering bulk purchases of the PI3EQX7741STZDE for various high-tech applications.
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Shipping Cost

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