PEF 20471 E V1.3
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- Mfr.Part #
- PEF 20471 E V1.3
- Manufacturer
- Infineon Technologies
- Package / Case
- 217-BGA
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 217BGA
- Stock
- 28,124
- In Stock ：
- 28,124
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Number of Circuits :
- 1
- Supplier Device Package :
- 217-BGA (23x23)
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 217-BGA
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Current - Supply :
- 200mA
- Operating Temperature :
- -40°C~85°C
- Function :
- Switching IC
- Voltage - Supply :
- 3.13V~3.47V
- Base Part Number :
- PEF20471
- Series :
- SWITI
- Interface :
- PCM, PLL
- Datasheets
- PEF 20471 E V1.3
PEF20471 Telecom device 1 Circuits
PEF 20471 E V1.3 Overview
A 217-BGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 1 circuits.Providing 3.13V~3.47V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.The PEF20471 base part number can be used to find more related parts.An electric current of 200mA is supplied to telecom equipment .With the SWITI series electronic parts, it can perform similar functions of the telecommunication product .
PEF 20471 E V1.3 Features
Available in the 217-BGA package
PEF 20471 E V1.3 Applications
There are a lot of Infineon Technologies
PEF 20471 E V1.3 Telecom applications.
- Fractional T1/E1/J1
- BITS Timing
- Digital Access Cross-connect System (DACs)
- Digital Cross-connect Systems (DCS)
- Frame Relay Switches and Access Devices (FRADS)
- ISDN Primary Rate Interfaces (PRA)
- PBXs channel bank
- PCM channel bank
- T3 channelized access concentrators
- M13 MUX
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