PEB 20256 E V2.1
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- Mfr.Part #
- PEB 20256 E V2.1
- Manufacturer
- Infineon Technologies
- Package / Case
- 388-BBGA
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 388BGA
- Stock
- 1,229
- In Stock ：
- 1,229
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Supplier Device Package :
- 388-BGA (35x35)
- Operating Temperature :
- 0°C~70°C
- Power (Watts) :
- 3W
- Interface :
- HDLC, PPP, Serial, TMA
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Function :
- Multichannel Network Interface Controller (MUNICH)
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 3V~3.6V
- Current - Supply :
- 200mA
- Packaging :
- Tray
- Package / Case :
- 388-BBGA
- Base Part Number :
- PEB20256
- Datasheets
- PEB 20256 E V2.1
Telecom Infineon Technologies PEB 20256 E V2.1 Overview
The Infineon Technologies PEB 20256 E V2.1 is a high-performance IC telecom interface that seamlessly integrates into telecom infrastructure equipment. Designed to meet the demanding requirements of modern telecommunications networks, this 388BGA packaged interface chip enhances the reliability and efficiency of communications systems. The Telecom Infineon Technologies PEB 20256 E V2.1 excels in high-speed data transmission and robust connectivity solutions, making it an essential component for developers and manufacturers looking to innovate and improve their telecommunications offerings.
PEB 20256 E V2.1 Features
This IC telecom interface chip is equipped with multiple features that ensure superior performance in complex telecom networks. Key features include advanced signal processing capabilities, high data throughput, and low power consumption. Its compatibility with various telecommunications standards ensures its versatility in different telecom applications, from high-density networking equipment to sophisticated communication modules.
PEB 20256 E V2.1 Applications
- High-Speed Network Infrastructure: The PEB 20256 E V2.1 can be utilized in routers and switches to manage data flow efficiently across network backbones, enhancing throughput and reducing latency.
- Wireless Base Stations: Essential for the deployment in cellular base stations, this chip supports robust data handling and signal integrity critical for 4G and emerging 5G technologies.
- Fiber Optic Systems: In fiber optic communications, the chip ensures high-speed data transmission capabilities, essential for backbone network infrastructures that demand reliability and high bandwidth.
- VoIP Systems: Utilized in Voice over Internet Protocol (VoIP) technology, it enhances signal processing for clearer voice transmission over internet-based systems.
- Satellite Communications: This IC is crucial in satellite communications equipment, where maintaining signal integrity and handling high data rates are paramount.
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