PC28F512P33BFD
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- Mfr.Part #
- PC28F512P33BFD
- Manufacturer
- Micron Technology
- Package / Case
- 64-TBGA
- Datasheet
- Download
- Description
- IC FLASH 512MBIT PAR 64EASYBGA
- Stock
- 37,957
- In Stock ：
- 37,957
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Terminal Finish :
- TIN SILVER COPPER
- Memory Interface :
- Parallel
- Write Cycle Time - Word, Page :
- 95ns
- Operating Temperature :
- -40°C~85°C TA
- Package / Case :
- 64-TBGA
- Surface Mount :
- yes
- Sync/Async :
- ASYNCHRONOUS
- Length :
- 10mm
- Nominal Supply Current :
- 31mA
- Pin Count :
- 64
- Published :
- 2008
- Base Part Number :
- 28F512P33
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Organization :
- 32MX16
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e1
- Supply Voltage :
- 3V
- Memory Width :
- 16
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 52MHz
- Series :
- Axcell™
- Voltage :
- 2.3V
- Word Size :
- 16b
- Interface :
- Parallel, Serial
- Number of Functions :
- 1
- Address Bus Width :
- 25b
- Memory Format :
- Flash
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 2.3V~3.6V
- Number of Terminations :
- 64
- Memory Size :
- 512Mb 32M x 16
- Number of Pins :
- 64
- Packaging :
- Tray
- Radiation Hardening :
- No
- Access Time (Max) :
- 95 ns
- Contact Plating :
- Copper, Silver, Tin
- Height Seated (Max) :
- 1.2mm
- Memory Type :
- Non-Volatile
- Terminal Position :
- BOTTOM
- Density :
- 512 Mb
- Datasheets
- PC28F512P33BFD
Memory Micron Technology PC28F512P33BFD Overview
The Memory Micron Technology PC28F512P33BFD is a high-capacity, 512Mbit flash memory device designed to meet the rigorous demands of modern industrial and technological applications. Engineered by Micron Technology, this integrated circuit is encapsulated in a compact 64-ball Easy BGA (EBGA) package, ensuring robust performance and reliability. Ideal for environments requiring high-speed, reliable data storage and retrieval, this memory component excels in delivering exceptional durability and stability across a broad range of applications. Its advanced architecture facilitates rapid programming and erasure, which are critical in fast-paced industrial settings.
PC28F512P33BFD Features
This IC flash memory boasts a parallel interface for high-speed data transfer, which is essential for applications that require swift boot and loading times. The 512Mbit capacity provides ample storage for complex firmware and application code, which can be crucial for sophisticated embedded systems. The durability of the EBGA package ensures that the device can withstand physical and thermal stress, making it an excellent choice for tough industrial environments.
PC28F512P33BFD Applications
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) to store firmware that improves vehicle safety and performance.
- Industrial Automation: Serves as a reliable solution for storing operational codes and system firmware in robotics and automated production lines, enhancing efficiency and reliability.
- Internet of Things (IoT) Devices: Provides high-capacity memory for smart devices, enabling sophisticated on-device analysis and decision-making capabilities.
- Consumer Electronics: Used in devices like digital cameras and gaming consoles, where large, fast memory is necessary for user interface and experience enhancements.
- Networking Equipment: Stores firmware and operating system images for network switches and routers, facilitating rapid system upgrades and maintenance.
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