PC28F256P30BFA

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Mfr.Part #
PC28F256P30BFA
Manufacturer
Micron Technology
Package / Case
64-TBGA
Datasheet
Download
Description
IC FLASH 256MBIT PAR 64EASYBGA
Stock
24,945
In Stock :
24,945

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Manufacturer :
Micron Technology
Product Category :
Memory
Radiation Hardening :
No
Alternate Memory Width :
16
Number of Functions :
1
JESD-609 Code :
e1
Word Size :
16b
Height Seated (Max) :
1.2mm
Standby Current-Max :
0.00021A
Base Part Number :
28F256P30
Toggle Bit :
No
Surface Mount :
yes
ECCN Code :
3A991.B.1.A
HTS Code :
8542.32.00.51
Memory Interface :
Parallel
Memory Width :
16
Memory Size :
256Mb 16M x 16
Published :
2008
Power Supplies :
1.81.8/3.3V
Terminal Finish :
TIN SILVER COPPER
Terminal Pitch :
1mm
Memory Type :
Non-Volatile
Package / Case :
64-TBGA
Organization :
16MX16
Sync/Async :
ASYNCHRONOUS
Voltage :
1.7V
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Write Cycle Time - Word, Page :
100ns
Address Bus Width :
24b
Density :
256 Mb
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~85°C TA
Length :
13mm
Operating Supply Voltage :
1.8V
Peak Reflow Temperature (Cel) :
260
Voltage - Supply :
1.7V~2V
Nominal Supply Current :
31mA
Number of Terminations :
64
Memory Format :
Flash
Number of Pins :
64
Boot Block :
BOTTOM
Number of Sectors/Size :
4255
Packaging :
Tray
Access Time (Max) :
100 ns
Clock Frequency :
52MHz
Interface :
Parallel, Serial
Series :
StrataFlash™
Pin Count :
64
Time@Peak Reflow Temperature-Max (s) :
30
Data Polling :
No
RoHS Status :
ROHS3 Compliant
Datasheets
PC28F256P30BFA
Introducing Memory Micron Technology PC28F256P30BFA from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:28F256P30, Package / Case:64-TBGA, Voltage:1.7V, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Number of Terminations:64, Number of Pins:64, PC28F256P30BFA pinout, PC28F256P30BFA datasheet PDF, PC28F256P30BFA amp .Beyond Memory Micron Technology PC28F256P30BFA ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology PC28F256P30BFA


Memory Micron Technology PC28F256P30BFA Overview

The Memory Micron Technology PC28F256P30BFA is a high-performance 256Mbit flash memory device designed by Micron Technology, ensuring reliable data storage and quick access speeds. Crafted in a compact 64-EasyBGA package, it seamlessly integrates into various advanced electronic systems. This product is engineered to meet the demanding specifications of contemporary technology solutions, offering durability and robustness in a range of operating environments. With its substantial storage capacity and proven reliability, it is an ideal solution for manufacturers looking to enhance the capability and longevity of their products.

PC28F256P30BFA Features

The PC28F256P30BFA flash memory chip boasts several key features that make it a standout choice for integration in advanced electronic systems. Its 256Mbit storage capacity provides ample space for firmware and data storage, while the parallel interface ensures high-speed data transfer and quick system responsiveness. The 64-EasyBGA package is designed for efficient space utilization and simplified PCB design, making it a versatile choice for compact applications.

PC28F256P30BFA Applications

  • Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles to store firmware updates and user preferences. The high storage capacity and speed enhance the user experience by ensuring smooth operation and reliability.
  • Automotive Systems: Integrated into automotive infotainment systems to manage navigation data, multimedia content, and system firmware. Its robustness ensures performance under a range of environmental conditions.
  • Industrial Automation: Employed in control systems for storing operational algorithms and user-defined settings. Its reliability and high data integrity are crucial for mission-critical applications.
  • Mobile Technology: Used in mobile devices for enhanced storage of OS components and applications. Its compact form factor and efficiency support the trend towards thinner, more powerful devices.
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