P6SMB18A

Manufacturer :

Taiwan Semiconductor

Product Category :

Published :

2008

Max Power Dissipation :

600W

Reverse Standoff Voltage :

15.3V

ECCN Code :

EAR99

Height :

2.61mm

Number of Pins :

2

Max Junction Temperature (Tj) :

150°C

JESD-609 Code :

e3

Mount :

Surface Mount

Max Surge Current :

24A

Package / Case :

DO-214AA, SMB

Direction :

Unidirectional

Terminal Form :

J BEND

Packaging :

Tape and Reel (TR)

Diode Element Material :

SILICON

Peak Reflow Temperature (Cel) :

260

Power Dissipation :

600W

Power Line Protection :

No

Peak Pulse Power :

600W

Number of Terminations :

2

Number of Elements :

1

Lead Free :

Lead Free

Mounting Type :

Surface Mount

Operating Supply Voltage :

15.3V

Peak Pulse Current :

24.2A

Additional Feature :

EXCELLENT CLAMPING CAPABILITY, UL RECOGNIZED

Operating Temperature :

-55°C~150°C TJ

Applications :

GENERAL PURPOSE

Reverse Breakdown Voltage :

17.1V

Breakdown Voltage :

17.1V

Clamping Voltage :

25.5V

Leakage Current :

1μA

Termination :

SMD/SMT

Terminal Position :

Dual

RoHS Status :

ROHS3 Compliant

Pin Count :

2

Time@Peak Reflow Temperature-Max (s) :

40

Max Breakdown Voltage :

18.9V

Series :

P6SMB

REACH SVHC :

Unknown

Configuration :

Single

Voltage - Clamping (Max) @ Ipp :

25.5V

Test Current :

1mA

Factory Lead Time :

17 Weeks

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Finish :

Matte Tin (Sn)

Type :

Zener