MXLSMBJ130CAE3

Manufacturer :

Microchip Technology

Product Category :

Terminal Form :

J BEND

Operating Temperature :

-65°C~150°C TJ

Pin Count :

2

Peak Pulse Current :

2.9A

Voltage - Breakdown (Min) :

144V

JESD-609 Code :

e3

Element Configuration :

Single

Number of Terminations :

2

Power Line Protection :

No

Terminal Position :

Dual

Terminal Finish :

MATTE TIN

Type :

Zener

ECCN Code :

EAR99

Power - Peak Pulse :

600W

Packaging :

Bulk

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Direction :

Bidirectional

Applications :

GENERAL PURPOSE

Number of Elements :

1

Published :

1997

Breakdown Voltage :

151.5V

Mounting Type :

Surface Mount

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Peak Pulse Power :

600W

Diode Element Material :

SILICON

Test Current :

1mA

Reverse Standoff Voltage :

130V

Series :

Military, MIL-PRF-19500

Max Reverse Leakage Current :

1μA

Number of Pins :

2

Bidirectional Channels :

1

Pbfree Code :

yes

Clamping Voltage :

209V

Additional Feature :

High Reliability

Package / Case :

DO-214AA, SMB

Mount :

Surface Mount

RoHS Status :

Non-RoHS Compliant