MTFC64GJDDN-3M WT

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Mfr.Part #
MTFC64GJDDN-3M WT
Manufacturer
Micron Technology
Package / Case
169-LFBGA
Datasheet
Download
Description
IC FLASH 512GBIT MMC 169LFBGA
Stock
1,766
In Stock :
1,766

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Manufacturer :
Micron Technology
Product Category :
Memory
Surface Mount :
yes
HTS Code :
8542.31.00.01
RoHS Status :
ROHS3 Compliant
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Published :
2013
Time@Peak Reflow Temperature-Max (s) :
30
Memory Size :
512Gb 64G x 8
Peak Reflow Temperature (Cel) :
260
Packaging :
Tray
JESD-30 Code :
R-PBGA-B169
Package / Case :
169-LFBGA
Supply Voltage :
1.8V
Terminal Finish :
TIN SILVER COPPER
Voltage - Supply :
1.65V~3.6V
Number of Terminations :
169
JESD-609 Code :
e1
Memory Interface :
MMC
Mounting Type :
Surface Mount
Factory Lead Time :
5 Weeks
Terminal Pitch :
0.5mm
Terminal Position :
BOTTOM
Additional Feature :
ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
14mm
Height Seated (Max) :
1.4mm
Memory Type :
Non-Volatile
Length :
18mm
Series :
e•MMC™
Memory Format :
Flash
Operating Temperature :
-25°C~85°C TA
Datasheets
MTFC64GJDDN-3M WT
Introducing Memory Micron Technology MTFC64GJDDN-3M WT from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:169-LFBGA, Number of Terminations:169, Mounting Type:Surface Mount, Operating Temperature:-25°C~85°C TA, MTFC64GJDDN-3M WT pinout, MTFC64GJDDN-3M WT datasheet PDF, MTFC64GJDDN-3M WT amp .Beyond Memory Micron Technology MTFC64GJDDN-3M WT ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MTFC64GJDDN-3M WT


Memory Micron Technology MTFC64GJDDN-3M WT Overview

The Memory Micron Technology MTFC64GJDDN-3M WT represents a cutting-edge integrated circuit designed for high-capacity data storage. Manufactured by Micron Technology, this IC flash memory offers an impressive 512 Gbit storage capability, all integrated into a compact 169-pin LFBGA (Low-profile Fine-pitch Ball Grid Array) package. It is specifically engineered to meet the demanding storage needs of modern applications, delivering high-speed data transfer and reliable performance. The robust design of this memory module makes it an ideal choice for businesses seeking to enhance their technology infrastructure with high-density, reliable storage solutions.

MTFC64GJDDN-3M WT Features

The MTFC64GJDDN-3M WT IC flash module is packed with features that stand out in the semiconductor industry. Key features include a vast 512 Gbit capacity and a highly efficient MMC interface, ensuring quick and seamless data management. The 169LFBGA package guarantees a minimal footprint on the PCB while providing ample storage, making it perfect for devices where space and high performance are critical. The durability of the module, combined with its advanced technology, offers an essential advantage for high-performance computing environments.

MTFC64GJDDN-3M WT Applications

  • Smartphones and Tablets: Provides ample storage for operating systems, applications, and user data, enhancing device performance and user experience.
  • Digital Cameras: Allows high-resolution image and video storage, facilitating quick access and saving of large files needed by professional photographers and videographers.
  • Portable Gaming Consoles: Used to store large game files and downloadable content, ensuring fast loading times and a smooth gaming experience.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) and infotainment systems by storing critical firmware and multimedia content.
  • Industrial Automation: Ideal for use in rugged environments, providing reliable data storage for machine control systems and operational data logging.
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