MT8985AP1

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Mfr.Part #
MT8985AP1
Manufacturer
Microchip Technology
Package / Case
44-LCC (J-Lead)
Datasheet
Download
Description
IC TELECOM INTERFACE 44PLCC
Stock
37,192
In Stock :
37,192

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Surface Mount :
yes
Terminal Form :
J BEND
Peak Reflow Temperature (Cel) :
260
Supply Voltage :
5V
Length :
16.585 mm
Number of Circuits :
1
Package Shape :
Square
Product Status :
Obsolete
Temperature Grade :
Industrial
Function :
Switch
Mount :
Surface Mount
Seated Height-Max :
4.57 mm
Operating Temp Range :
85C
Series :
-
Port Speed :
2.048Mbps
Operating Supply Current :
10mA
Number of Terminations :
44
Reach Compliance Code :
Compliant
Current - Supply :
10mA
Package / Case :
44-LCC (J-Lead)
Number of Terminals :
44
JESD-609 Code :
e3
JESD-30 Code :
S-PQCC-J44
Operating Supply Voltage :
5V
Time@Peak Reflow Temperature-Max (s) :
30
Supplier Device Package :
44-PLCC (16.59x16.59)
Factory Lead Time :
7 Weeks
Terminal Pitch :
1.27 mm
Number of Pins :
44
Operating Supply Voltage (Min) :
4.75(V)
Published :
2006
Manufacturer :
Microsemi Corporation
Package :
Tube
Pin Count :
44
HTS Code :
8542.39.00.01
Height Seated (Max) :
4.57mm
Power Supplies :
5V
Voltage - Supply :
4.75V~5.25V
Number of Functions :
1
Max Supply Current :
10mA
Terminal Position :
QUAD
Operating Temperature :
-40°C~85°C
Pbfree Code :
yes
Switch Core :
Non-Blocking
RoHS Status :
ROHS3 Compliant
Qualification Status :
Not Qualified
Width :
16.585 mm
Operating Supply Voltage (Max) :
5.25(V)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tube
Terminal Finish :
MATTE TIN
Telecom IC Type :
DIGITAL TIME SWITCH
Radiation Hardening :
No
Package Type :
PLCC
Supply Current-Max :
15 mA
Max Power Dissipation :
2W
Interface :
-
Mounting Type :
Surface Mount
Fabric Size :
256 X 256
Number of Ports :
8
Weight :
2.386605g
Datasheets
MT8985AP1
Introducing Telecom Microchip Technology MT8985AP1 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:44, Package / Case:44-LCC (J-Lead), Number of Pins:44, Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, MT8985AP1 pinout, MT8985AP1 datasheet PDF, MT8985AP1 amp .Beyond Telecom Microchip Technology MT8985AP1 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MT8985AP1


Telecom Microchip Technology MT8985AP1 Overview

The Telecom Microchip Technology MT8985AP1 is a state-of-the-art Integrated Circuit specifically designed for telecom interface applications. This IC, encased in a 44PLCC package, serves as a robust platform for developing telecommunications equipment. The product is engineered by Microchip Technology, a leader in semiconductor technology, ensuring high reliability and performance. The MT8985AP1 is ideal for manufacturers and developers looking to enhance their communications infrastructure with a scalable and efficient solution that promises not only longevity but also superior functionality in demanding environments.

MT8985AP1 Features

This IC features multiple functionalities tailored for the telecommunications sector. It includes advanced signal processing capabilities, low power consumption, and high integration that facilitates compact designs. Additionally, its compatibility with various communication protocols enhances its versatility in deployment across different telecom systems, ensuring a broad application scope and adaptability.

MT8985AP1 Applications

  • Telecommunication Switching Systems: Utilized in the core of telecom infrastructure to manage and route calls efficiently across networks.
  • VoIP Gateways: Essential in converting voice from an analog phone system to digital packets for transmission over the Internet, enhancing the clarity and speed of voice communications.
  • Wireless Base Stations: Supports signal processing tasks necessary for the operation of cellular base stations, facilitating improved connectivity and bandwidth management.
  • Integrated Access Devices: Used in devices that consolidate multiple communication services, such as voice and data, providing a unified platform that simplifies telecommunications architecture.
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