MT53E768M32D4DT-046 WT:E TR

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Mfr.Part #
MT53E768M32D4DT-046 WT:E TR
Manufacturer
Micron Technology
Package / Case
200-VFBGA
Datasheet
Download
Description
IC DRAM 24GBIT 2.133GHZ 200VFBGA
Stock
17,010
In Stock :
17,010

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Manufacturer :
Micron Technology
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Automotive, AEC-Q100
Package / Case :
200-VFBGA
Operating Temperature :
-30°C~85°C TC
Memory Format :
DRAM
Clock Frequency :
2.133GHz
Memory Size :
24Gb 768M x 32
Voltage - Supply :
0.6V 1.1V
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Memory Type :
Volatile
Packaging :
Tape and Reel (TR)
Introducing Memory Micron Technology MT53E768M32D4DT-046 WT:E TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-VFBGA, Operating Temperature:-30°C~85°C TC, Mounting Type:Surface Mount, MT53E768M32D4DT-046 WT:E TR pinout, MT53E768M32D4DT-046 WT:E TR datasheet PDF, MT53E768M32D4DT-046 WT:E TR amp .Beyond Memory Micron Technology MT53E768M32D4DT-046 WT:E TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53E768M32D4DT-046 WT:E TR


Memory Micron Technology MT53E768M32D4DT-046 WT:E TR Overview

The Memory Micron Technology MT53E768M32D4DT-046 WT:E TR is a high-performance Integrated Circuit (IC) DRAM from Micron Technology, designed to deliver robust speed and reliability. Engineered to support demanding applications, this IC features a substantial 24Gbit density and operates at a speed of 2.133GHz. Packaged in a compact 200-ball VFBGA, it offers excellent thermal performance and reduced power consumption, making it an ideal choice for advanced computing and data-intensive environments. Its superior design and advanced technology cater to a diverse range of applications, ensuring optimal performance and scalability.

MT53E768M32D4DT-046 WT:E TR Features

This DRAM IC excels in its technical capabilities, featuring a high-speed interface of 2.133GHz which ensures rapid access to large volumes of data, crucial for high-speed computing tasks. The 24Gbit density allows for expansive memory capacity within a single chip, facilitating efficient processing and storage solutions. Its 200-ball VFBGA packaging is optimized for space-saving installations while enabling effective thermal management and long-term reliability.

MT53E768M32D4DT-046 WT:E TR Applications

  • Advanced Computing Systems: Utilized in server farms and data centers where large-scale data processing and storage are required. The high capacity and speed of this DRAM IC ensure seamless performance under heavy loads.
  • Mobile Devices: Integrated into smartphones and tablets to enhance multitasking and media performance, leveraging its high-speed data access and substantial memory capacity.
  • Automotive Applications: Employed in advanced driver-assistance systems (ADAS) and infotainment systems, where quick data processing is crucial for real-time responsiveness and functionality.
  • Networking Equipment: Used in routers and switches to manage high traffic volumes efficiently. Its ability to quickly process and store data improves the overall efficiency of network devices.
  • Consumer Electronics: Applied in gaming consoles and high-definition televisions to boost processing power and enhance user experience with reduced lag and improved graphics performance.
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Shipping Cost

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