MT53B512M32D2NP-053 WT:C

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Mfr.Part #
MT53B512M32D2NP-053 WT:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 1866MHZ 200WFBGA
Stock
34,819
In Stock :
34,819

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Manufacturer :
Micron Technology
Product Category :
Memory
Operating Temperature :
-30°C~85°C TC
Package / Case :
200-WFBGA
Voltage - Supply :
1.1V
Packaging :
Tray
Mounting Type :
Surface Mount
Clock Frequency :
1866MHz
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
16Gb 512M x 32
RoHS Status :
ROHS3 Compliant
Memory Format :
DRAM
Introducing Memory Micron Technology MT53B512M32D2NP-053 WT:C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~85°C TC, Package / Case:200-WFBGA, Mounting Type:Surface Mount, MT53B512M32D2NP-053 WT:C pinout, MT53B512M32D2NP-053 WT:C datasheet PDF, MT53B512M32D2NP-053 WT:C amp .Beyond Memory Micron Technology MT53B512M32D2NP-053 WT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B512M32D2NP-053 WT:C


Memory Micron Technology MT53B512M32D2NP-053 WT:C Overview

Introducing the Memory Micron Technology MT53B512M32D2NP-053 WT:C, a state-of-the-art integrated circuit from Micron Technology. This DRAM product boasts a substantial 16Gbit capacity with a performance speed of 1866MHz, encapsulated in a compact 200-ball WFBGA package. Designed to meet the rigorous demands of advanced computing systems, this IC offers exceptional reliability and speed, enhancing system performance and efficiency. Its high-speed interface ensures rapid data transfer rates, making it an excellent choice for high-performance applications where speed and capacity are critical.

MT53B512M32D2NP-053 WT:C Features

  • Capacity: 16Gbit, providing substantial storage potential for complex processes.
  • Speed: 1866MHz, ensuring quick access to stored data and smooth system performance.
  • Package: 200-ball WFBGA, offering a space-efficient footprint for densely packed electronic assemblies.
  • Compatibility: Designed for versatility across multiple platforms, enhancing its suitability for various high-end applications.

MT53B512M32D2NP-053 WT:C Applications

  • Advanced Computing Systems: This DRAM chip is ideal for server farms and data centers requiring high-speed memory to handle large volumes of data efficiently.
  • High-Performance Computing (HPC): Critical in applications demanding intense computational power, such as scientific simulations and complex analytics.
  • Gaming and Graphics: Used in high-end gaming computers and graphics processing units (GPUs) where fast and high-capacity memory is essential for rendering detailed graphics smoothly.
  • Mobile Computing: Suitable for high-performance mobile devices, enhancing multitasking capabilities and improving user experience.
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