MT53B512M32D2DS-062 XT:C TR

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Mfr.Part #
MT53B512M32D2DS-062 XT:C TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 1600MHZ 200WFBGA
Stock
3,427
In Stock :
3,427

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Manufacturer :
Micron Technology
Product Category :
Memory
Voltage - Supply :
1.1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Packaging :
Tape and Reel (TR)
Operating Temperature :
-30°C~105°C TC
RoHS Status :
ROHS3 Compliant
Memory Format :
DRAM
Memory Type :
Volatile
Package / Case :
200-WFBGA
Memory Size :
16Gb 512M x 32
Clock Frequency :
1600MHz
Introducing Memory Micron Technology MT53B512M32D2DS-062 XT:C TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-30°C~105°C TC, Package / Case:200-WFBGA, MT53B512M32D2DS-062 XT:C TR pinout, MT53B512M32D2DS-062 XT:C TR datasheet PDF, MT53B512M32D2DS-062 XT:C TR amp .Beyond Memory Micron Technology MT53B512M32D2DS-062 XT:C TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B512M32D2DS-062 XT:C TR


Memory Micron Technology MT53B512M32D2DS-062 XT:C TR Overview

Introducing the Memory Micron Technology MT53B512M32D2DS-062 XT:C TR, a high-performance IC DRAM from Micron Technology, crafted for demanding applications that require substantial data throughput and speed. This 16Gbit DRAM operates at a robust speed of 1600MHz and is packaged in a compact 200-ball WFBGA format, offering optimal density for space-sensitive applications while maintaining low power consumption. The advanced technology integrated into this product supports superior scalability and reliability, making it a prime choice for businesses looking to enhance their system's memory capabilities efficiently and cost-effectively.

MT53B512M32D2DS-062 XT:C TR Features

The MT53B512M32D2DS-062 XT:C TR boasts significant features that make it stand out in the competitive memory segment:

  • High Capacity: 16Gbit of storage capacity ensures extensive data management and storage options for complex applications.
  • High Speed: A speed of 1600MHz allows for rapid data access and processing, enhancing overall system performance.
  • Compact Packaging: The 200-ball WFBGA package is designed for efficient space utilization in densely packed electronic environments.
  • Low Power Consumption: This DRAM module is engineered to consume less power, which helps in reducing the thermal footprint and enhancing system stability.

MT53B512M32D2DS-062 XT:C TR Applications

  • Advanced Computing Systems: Utilized in server farms and data centers where large amounts of data are processed and high memory bandwidth is required.
  • Consumer Electronics: Ideal for high-performance gaming consoles and computers, providing the necessary speed and capacity to handle intensive multimedia and gaming applications.
  • Mobile Devices: Supports smartphones and tablets requiring high memory capacity and speed for seamless multitasking and media processing.
  • Networking Hardware: Applied in routers and switches, enhancing the capability to manage high-speed data traffic efficiently.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS) where quick data processing is critical for real-time decision making.
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Shipping Cost

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