MT53B512M32D2DS-062 XT:C

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Mfr.Part #
MT53B512M32D2DS-062 XT:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 1600MHZ 200WFBGA
Stock
10,173
In Stock :
10,173

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Manufacturer :
Micron Technology
Product Category :
Memory
Clock Frequency :
1600MHz
Memory Format :
DRAM
Memory Type :
Volatile
RoHS Status :
ROHS3 Compliant
Package / Case :
200-WFBGA
Operating Temperature :
-30°C~105°C TC
Mounting Type :
Surface Mount
Memory Size :
16Gb 512M x 32
Packaging :
Tray
Voltage - Supply :
1.1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing Memory Micron Technology MT53B512M32D2DS-062 XT:C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Operating Temperature:-30°C~105°C TC, Mounting Type:Surface Mount, MT53B512M32D2DS-062 XT:C pinout, MT53B512M32D2DS-062 XT:C datasheet PDF, MT53B512M32D2DS-062 XT:C amp .Beyond Memory Micron Technology MT53B512M32D2DS-062 XT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B512M32D2DS-062 XT:C


Memory Micron Technology MT53B512M32D2DS-062 XT:C Overview

Introducing the Memory Micron Technology MT53B512M32D2DS-062 XT:C, a cutting-edge Integrated Circuit (IC) from Micron Technology, designed for robust performance in demanding applications. This 16Gbit DRAM module features a high-speed interface with a clock speed of 1600MHz, encapsulated in a compact 200-ball WFBGA (fine-pitch ball grid array) package. The product is tailored for systems requiring high-density memory with excellent power efficiency, offering a strategic blend of speed and reliability that is crucial for modern electronic environments.

MT53B512M32D2DS-062 XT:C Features

The MT53B512M32D2DS-062 XT:C stands out with its high-capacity data storage capabilities, supporting up to 16Gbit of memory. This IC operates at a high speed of 1600MHz, ensuring rapid data processing and smooth system performance. Its 200WFBGA packaging not only saves space but also enhances thermal management and reliability in dense electronic assemblies. With a focus on power efficiency, it reduces overall energy consumption, making it an ideal choice for eco-conscious operations.

MT53B512M32D2DS-062 XT:C Applications

  • Smartphones and Tablets: Utilizes high-density, high-speed memory to manage multiple applications and media playback seamlessly, enhancing user experience.
  • Personal Computers: Provides extensive memory capacity required for multitasking and demanding software applications, contributing to faster system performance.
  • Servers: Supports large-scale data processing and storage solutions, crucial for managing extensive databases and high traffic loads with reliability.
  • Gaming Consoles: Enhances gaming performance with faster load times and improved responsiveness, delivering a smoother gaming experience.
  • Automotive Systems: Critical for advanced driver-assistance systems (ADAS) where rapid data processing is essential for real-time decision making.
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