MT53B512M32D2DS-062 AIT:C

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Mfr.Part #
MT53B512M32D2DS-062 AIT:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 1600MHZ 200WFBGA
Stock
11,622
In Stock :
11,622

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tray
Package / Case :
200-WFBGA
Clock Frequency :
1600MHz
Mounting Type :
Surface Mount
Memory Type :
Volatile
Memory Format :
DRAM
Operating Temperature :
-40°C~95°C TC
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.1V
Memory Size :
16Gb 512M x 32
Introducing Memory Micron Technology MT53B512M32D2DS-062 AIT:C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~95°C TC, MT53B512M32D2DS-062 AIT:C pinout, MT53B512M32D2DS-062 AIT:C datasheet PDF, MT53B512M32D2DS-062 AIT:C amp .Beyond Memory Micron Technology MT53B512M32D2DS-062 AIT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B512M32D2DS-062 AIT:C


Memory Micron Technology MT53B512M32D2DS-062 AIT:C Overview

The Memory Micron Technology MT53B512M32D2DS-062 AIT:C is a high-performance IC DRAM designed to meet the intense requirements of modern applications. Manufactured by Micron Technology, one of the leaders in memory innovation, this 16Gbit DRAM module provides an impressive data rate of 1600MHz, making it an excellent choice for advanced computing systems requiring extensive memory bandwidth and higher speeds. Packaged in a compact 200-ball WFBGA (fine-pitch ball grid array), it offers robustness and reliability for systems operating under varying thermal and mechanical conditions.

MT53B512M32D2DS-062 AIT:C Features

This DRAM module features a 16 Gbit density, which provides ample space for large-scale applications, and the 1600MHz clock speed enhances throughput for high-speed data processing. The 200 WFBGA packaging not only ensures a small form factor but also enhances the thermal characteristics, which is crucial for maintaining stability and performance in dense configuration environments.

MT53B512M32D2DS-062 AIT:C Applications

  • Server Memory: Utilized in server farms to enhance data retrieval speeds and handle large databases efficiently.
  • High-Performance Computing (HPC): Critical for applications requiring massive computational power, such as scientific simulations and financial modeling.
  • Networking Equipment: Increases the efficiency of data flow management in network routers and switches.
  • Gaming Consoles: Improves gaming experience by speeding up memory accesses, crucial for high-resolution and fast-paced games.
  • Mobile Devices: Applied in smartphones and tablets to manage multiple applications and user data effectively without lag.
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