MT53B384M32D2DS-062 XT:B TR

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Mfr.Part #
MT53B384M32D2DS-062 XT:B TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1600MHZ 200WFBGA
Stock
26,709
In Stock :
26,709

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tape and Reel (TR)
Operating Temperature :
-30°C~105°C TC
Package / Case :
200-WFBGA
Mounting Type :
Surface Mount
Memory Size :
12Gb 384M x 32
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
DRAM
Clock Frequency :
1600MHz
Voltage - Supply :
1.1V
RoHS Status :
ROHS3 Compliant
Memory Type :
Volatile
Introducing Memory Micron Technology MT53B384M32D2DS-062 XT:B TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~105°C TC, Package / Case:200-WFBGA, Mounting Type:Surface Mount, MT53B384M32D2DS-062 XT:B TR pinout, MT53B384M32D2DS-062 XT:B TR datasheet PDF, MT53B384M32D2DS-062 XT:B TR amp .Beyond Memory Micron Technology MT53B384M32D2DS-062 XT:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B384M32D2DS-062 XT:B TR


Memory Micron Technology MT53B384M32D2DS-062 XT:B TR Overview

The Memory Micron Technology MT53B384M32D2DS-062 XT:B TR is a high-performance DRAM IC that excels in robust data handling and storage capabilities. Manufactured by Micron Technology, this integrated circuit features a substantial 12Gbit density and operates at a speed of 1600MHz. Its compact 200WFBGA package is designed for efficient thermal management and space-saving installation, making it ideal for advanced computing environments that demand reliable and continuous memory performance. This product is tailored to meet the needs of businesses looking for scalable solutions in data-intensive applications, ensuring high-speed data processing and storage with exceptional reliability.

MT53B384M32D2DS-062 XT:B TR Features

The MT53B384M32D2DS-062 XT:B TR DRAM from Micron Technology offers significant features that enhance its utility in complex electronic systems. With a 12Gbit capacity and a fast 1600MHz operational speed, it ensures high efficiency and bandwidth. The compact 200WFBGA package supports better integration into various hardware setups while maintaining superior thermal characteristics. This DRAM is designed for optimal stability and high throughput, catering to the rigorous demands of modern technology infrastructures.

MT53B384M32D2DS-062 XT:B TR Applications

  • Enterprise Servers: Utilizes its high-speed interface and large capacity for managing extensive databases and real-time data processing.
  • High-Performance Computing (HPC): Supports computations that require high bandwidth and storage capabilities, ideal for scientific simulations and complex calculations.
  • Data Centers: Provides the backbone for storage solutions in cloud services, ensuring fast access to large amounts of data for efficient cloud computing operations.
  • Networking Equipment: Enhances data throughput and bandwidth in routers and switches, crucial for maintaining high-speed network communications.
  • Consumer Electronics: Used in high-end gaming consoles and PCs, where quick memory access is essential for smooth and enhanced gaming experiences.
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