MT47H64M8CB-37E:B
- Mfr.Part #
- MT47H64M8CB-37E:B
- Manufacturer
- Micron Technology
- Package / Case
- 60-FBGA
- Datasheet
- Download
- Description
- IC DRAM 512MBIT PARALLEL 60FBGA
- Stock
- 27,599
- In Stock :
- 27,599
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Terminal Pitch :
- 0.8mm
- Clock Frequency :
- 267MHz
- Lead Free :
- Lead Free
- Supply Voltage-Min (Vsup) :
- 1.7V
- Write Cycle Time - Word, Page :
- 15ns
- Length :
- 12mm
- Memory Type :
- Volatile
- Additional Feature :
- AUTO/SELF REFRESH
- Reach Compliance Code :
- not_compliant
- Output Characteristics :
- 3-STATE
- Operating Temperature :
- 0°C~85°C TC
- Terminal Position :
- BOTTOM
- Density :
- 512 Mb
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Qualification Status :
- Not Qualified
- Address Bus Width :
- 16b
- Sequential Burst Length :
- 48
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Memory Size :
- 512Mb 64M x 8
- Operating Mode :
- SYNCHRONOUS
- Memory Format :
- DRAM
- Operating Supply Voltage :
- 1.8V
- HTS Code :
- 8542.32.00.28
- Supply Voltage-Max (Vsup) :
- 1.9V
- Access Time :
- 500ps
- Mount :
- Surface Mount
- Nominal Supply Current :
- 145mA
- Number of Pins :
- 60
- Pin Count :
- 60
- Base Part Number :
- MT47H64M8
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Package / Case :
- 60-FBGA
- Number of Terminations :
- 60
- Published :
- 2006
- Refresh Cycles :
- 8192
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Supply Voltage :
- 1.8V
- Voltage - Supply :
- 1.7V~1.9V
- Packaging :
- Tray
- I/O Type :
- COMMON
- Number of Ports :
- 1
- Number of Functions :
- 1
- Interleaved Burst Length :
- 48
- Organization :
- 64MX8
- Height Seated (Max) :
- 1.2mm
- Memory Width :
- 8
- JESD-609 Code :
- e1
- Memory Interface :
- Parallel
- ECCN Code :
- EAR99
- Peak Reflow Temperature (Cel) :
- 260
- Standby Current-Max :
- 0.007A
- Datasheets
- MT47H64M8CB-37E:B

Memory Micron Technology MT47H64M8CB-37E:B Overview
The Memory Micron Technology MT47H64M8CB-37E:B is a high-performance 512Mbit DRAM integrated circuit from Micron Technology, designed to deliver superior reliability and speed for advanced computing solutions. This memory module is encapsulated in a compact 60-ball fine-pitch ball grid array (FBGA) package, making it ideal for high-density applications that require a small form factor and minimal power consumption. With its robust design and advanced technology, the Memory Micron Technology MT47H64M8CB-37E:B ensures exceptional throughput and efficiency, suitable for a broad range of industrial and commercial applications.
MT47H64M8CB-37E:B Features
This 512Mbit DRAM module operates in a parallel interface configuration, ensuring high-speed data transfer rates that are essential for performance-critical applications. It is designed to work at a nominal supply voltage, providing optimal performance while maintaining energy efficiency. The device's stability and reliability are enhanced by its advanced fabrication technology, which significantly reduces the risk of data corruption and ensures longevity and consistent performance.
MT47H64M8CB-37E:B Applications
- Computing Systems: Utilized in both desktop and server memory modules, enhancing system responsiveness and multitasking capabilities.
- Telecommunications: Critical for use in telecommunications equipment where large volumes of data are processed and stored, ensuring efficient and reliable operations.
- Networking Equipment: Employs in routers and switches, improving packet processing speeds and overall network performance.
- Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, offering enhanced graphics and faster processing speeds.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to manage real-time sensor data processing, contributing to safer driving experiences.
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